Chung Wei Yang

US Patent:

6537846, Mar 25, 2003

Filed:

Mar 30, 2001

Appl. No.:

09/823550

Inventors:

Heon Lee - Sunnyvale CA
Chung Ching Yang - Saratoga CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 2106

US Classification:

438102, 438455, 438456, 143 331, 143 336

Abstract:

A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on a bonding surface of an active substrate and forming a second multi-stacked layer of selenium and indium on a mounting surface of a base substrate. The first and second multi-stacked layers are placed into contact with each other with substantially no pressure. Then the active substrate and the base substrate are bonded to each other by annealing them in an inert ambient to form an indium-selenium compound bond layer that adhesively bonds the substrates to each other. The annealing can occur at a lower temperature than prior wafer-bonding processes and the first and second multi-stacked layers can be deposited over a wide range of relatively low temperatures including room temperature. Additionally, tellurium can be added to the selenium of either one or both of the first and second multi-stacked layers to reduce the annealing temperature and to form an indium-selenium-tellurium compound bond layer that adhesively bonds the substrates to each other. Elemental compounds or amorphous compounds can be used for the materials of the first and second multi-stacked layers to form a polycrystalline or amorphous compound bond layer respectively.

US Patent:

6930368, Aug 16, 2005

Filed:

Jul 31, 2003

Appl. No.:

10/630769

Inventors:

Peter G. Hartwell - Sunnyvale CA, US
Storrs T. Hoen - Brisbane CA, US
David Horsley - Berkeley CA, US
Chung Ching Yang - Saratoga CA, US
Paul P. Merchant - Belmont CA, US
Carl P. Taussig - Redwood City CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L029/82

US Classification:

257418, 257417

Abstract:

A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.

US Patent:

7080897, Jul 25, 2006

Filed:

Oct 31, 2003

Appl. No.:

10/697974

Inventors:

Chung C. Yang - Saratoga CA, US
Gary Gibson - Palo Alto CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/02
B41J 2/04

US Classification:

347 75, 347 73, 347 54

Abstract:

A system for delivering material onto a substrate. The system includes a jetting system having a reservoir containing the material and the reservoir includes a nozzle through which the material is expelled from the reservoir. An arcuate section is positioned between the reservoir and the nozzle. The material is configured to travel from the reservoir, through the arcuate section, and through the nozzle. The system also includes a means for applying pressure on the material contained in the reservoir, wherein the material is expelled from the reservoir through application of pressure by the means for applying pressure to thereby create a column of the material from the nozzle. A means for producing pressure modulations is located proximate the nozzle and is configured to substantially regulate formation of droplets from the column of the material. In addition, the system includes a charging ring configured to induce an electrical charge to selective ones of the droplets as they pass through the charging ring. One or more deflection plates is also included for altering a trajectory of the charged droplets.

US Patent:

7185973, Mar 6, 2007

Filed:

Oct 1, 2004

Appl. No.:

10/954263

Inventors:

Gary A. Gibson - Palo Alto CA, US
Krzysztof Nauka - Redwood City CA, US
Chung Ching Yang - Saratoga CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/09
B41J 2/02

US Classification:

347 77, 347 73

Abstract:

An assembly for depositing material onto a substrate includes a reservoir containing the material. The reservoir also includes a nozzle through which the material is jetted and formed into droplets. The droplets travel through flight paths prior to deposition onto the substrate. The assembly includes a charging ring for inducing an electrical charge to one or more of the droplets and a plurality of deflection plates for controlling the flight paths of the droplets. In addition, the assembly also includes a droplet manipulating device configured to manipulate the droplets at least one of during the flight paths and after deposition of the droplets onto the substrate.

US Patent:

7391706, Jun 24, 2008

Filed:

Oct 31, 2003

Appl. No.:

10/698717

Inventors:

Krzysztof Nauka - Redwood City CA, US
Chung C. Yang - Saratoga CA, US

Assignee:

Samsung Electronics Co., Ltd. - Gyeonggi-do

International Classification:

G11B 7/00

US Classification:

369126, 369101

Abstract:

A data storage device includes a conductive probe having a tip; a substrate; and a data storage medium including a layer of poled ferroelectric material. The ferroelectric layer is between the tip and the substrate.

US Patent:

7496216, Feb 24, 2009

Filed:

Jun 21, 2005

Appl. No.:

11/157649

Inventors:

Sui-hing Leung - Cupertino CA, US
Sean Xiao-An Zhang - Cupertino CA, US
Chung Ching Yang - Saratoga CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G06K 9/00

US Classification:

382124, 382125

Abstract:

A system and method of capturing a skin print from skin having ridges and valleys. A skin print sensor having a return/supply contact and a plurality of contact pads is provided. A finger is applied to the skin print sensor and data is stored representative of contact pads in contact with skin ridges.

US Patent:

7869336, Jan 11, 2011

Filed:

Jun 2, 2008

Appl. No.:

12/131664

Inventors:

Krzysztof Nauka - Redwood City CA, US
Chung C. Yang - Saratoga CA, US

Assignee:

Samsung Electronics Co., Ltd. - Gyeonggi-do

International Classification:

G11B 7/00

US Classification:

369126, 369101

Abstract:

A data storage device includes a conductive probe having a tip; a substrate; and a data storage medium including a layer of poled ferroelectric material. The ferroelectric layer is between the tip and the substrate.

US Patent:

8003980, Aug 23, 2011

Filed:

Jan 30, 2007

Appl. No.:

11/700447

Inventors:

Xia Sheng - Palo Alto CA, US
Krzysztof Nauka - Palo Alto CA, US
Chung Ching Yang - Palo Alto CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 29/08
H01L 35/24
H01L 51/00

US Classification:

257 40, 257E21024, 257E51001, 257E51002, 257E51003, 257E51004, 257E51005, 257E51006, 257E51008, 257E51009, 257E51022, 257E51023, 257E51024, 257E51025, 257E51026

Abstract:

The present invention is drawn to a layered organic device, and a method of forming the same. The method includes steps of applying a first solvent-containing organic layer to a substrate and removing solvent from the first solvent-containing organic layer to form a first solidified organic layer. Additional steps include applying a second solvent-containing organic layer to the first solidified organic layer and removing solvent from the second solvent-containing organic layer to form a second solidified organic layer. The first solidified organic layer can be crosslinked, which suppresses negative impact to components in the first solidified organic layer when the solvent of the second solvent-containing organic layer is deposited on the first solidified organic layer.