David C Cohn

US Patent:

6537852, Mar 25, 2003

Filed:

Aug 22, 2001

Appl. No.:

09/935300

Inventors:

David Leslie Cohn - Austin TX
Dennis Jay McBride - Wake Forest NC
Robert Kevin Montoye - Austin TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438109

Abstract:

A spacer-connector stud comprises a stacked array of glass epoxy laminates, each laminate having a copper layer laminated thereto. The top and bottom laminates of the stud include a spatial array of thermal contacts suitable as a footprint for C4 bump technology. A location is selected on a circuitized base card to accommodate the laminated stud. The stud has a thickness greater than twice the thickness of the components attached to the card. The thermal contacts on the stud, typically solderable, join to a wiring array on the card. A second multi-chip module card having attached and interconnected components on both sides of the second card is mechanically aligned with the based card and pressed against the contacts on the top layer of the stud to form an assembly. The assembly is heated causing the second card to become soldered to the contact footprint on the stud.

US Patent:

6667555, Dec 23, 2003

Filed:

Nov 21, 2002

Appl. No.:

10/301196

Inventors:

David Leslie Cohn - Austin TX
Dennis Jay McBride - Wake Forest NC
Robert Kevin Montoye - Austin TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348

US Classification:

257777, 257685, 257686, 257720, 257723, 257724

Abstract:

A spacer-connector stud comprises a stacked array of glass epoxy laminates, each laminate having a copper layer laminated thereto. The top and bottom laminates of the stud include a spatial array of thermal contacts suitable as a footprint for C4 bump technology. A location is selected on a circuitized base card to accommodate the laminated stud. The stud has a thickness greater than twice the thickness of the components attached to the card. The thermal contacts on the stud, typically solderable, join to a wiring array on the card. A second multi-chip module card having attached and interconnected components on both sides of the second card is mechanically aligned with the based card and pressed against the contacts on the top layer of the stud to form an assembly. The assembly is heated causing the second card to become soldered to the contact footprint on the stud.

US Patent:

6848034, Jan 25, 2005

Filed:

Apr 4, 2002

Appl. No.:

10/116650

Inventors:

David L. Cohn - Austin TX, US
Bruce A. Smith - Austin TX, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 1208

US Classification:

711153, 711147, 711173

Abstract:

A method, system and computer program product for sharing an Integrated Device Electronics (IDE) drive among server blades in a dense server environment. By logically partitioning the IDE drive, where each logical partition is associated with a particular server blade, the IDE disk may be shared among multiple server blades in the dense server environment.