David P Duarte

US Patent:

7498892, Mar 3, 2009

Filed:

Mar 14, 2007

Appl. No.:

11/724102

Inventors:

Keng L. Wong - Portland OR, US
Mingwei Huang - Portland OR, US
David Duarte - Portland OR, US
Shuching Hsu - Hillsboro OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H03B 5/24
H03K 3/03
H03L 7/099

US Classification:

331 57, 331 10, 331 34, 331177 R, 331179

Abstract:

A voltage-controlled oscillator (VCO) of ring-connected stages, where each stage in the VCO has a first set of differential inverters biased by variable bias voltages, and a second set of differential inverters biased by fixed bias voltages. The differential inverters in each stage are connected in parallel with each other. Each set of differential inverters in a stage may contain only one differential inverter. The variable bias voltages are provided by charge pumps and associated circuits as used in well-known self-biasing schemes for phase locked loops. The fixed bias voltages are provided by a biasing circuit, matched to the circuits associated with the charge pumps, but where a fixed control voltage is applied to provide the fixed bias voltages.

US Patent:

7512514, Mar 31, 2009

Filed:

Sep 29, 2006

Appl. No.:

11/540002

Inventors:

David Duarte - Portland OR, US
George Geannopoulos - Portland OR, US
Usman Mughal - Hillsboro OR, US
Venkatesh Prasanna - Folsom CA, US
Kedar Mangrulkar - Folsom CA, US
Mathew Nazareth - El Dorado Hills CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 35/00

US Classification:

702130, 702131, 702132, 374141, 374166, 713320, 713321, 713322, 713323

Abstract:

An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

US Patent:

7565258, Jul 21, 2009

Filed:

Mar 6, 2006

Appl. No.:

11/369746

Inventors:

David E. Duarte - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G01K 1/08

US Classification:

702132, 62 37, 307117, 327513

Abstract:

In one embodiment, an apparatus is constituted with a temperature sensing circuit adapted to be coupled to a current sources circuit, and configured to measure a circuit temperature and to generate a temperature-indicating signal in response to the circuit temperature and an adjustable current output by the current sources circuit; a reference voltage circuit to be coupled the current sources circuit and configured to provide a reference signal in response to a reference current output by the current sources circuit; and a trip generator circuit coupled to the temperature sensing circuit and the reference voltage circuit and configured to generate a trip point signal if a difference between the reference and the temperature-indicating signals indicates that a threshold circuit temperature has been reached or exceeded.

US Patent:

8314725, Nov 20, 2012

Filed:

Sep 15, 2010

Appl. No.:

12/883125

Inventors:

Paola Zepeda - Chandler AZ, US
David E. Duarte - Portland OR, US
Gregory F. Taylor - Portland OR, US
Atul Maheshwari - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H03M 1/10

US Classification:

341120, 341118, 341119, 341121, 341155

Abstract:

In one embodiment, an analog-to-digital conversion in an integrated circuit is evaluated by an on-die testing circuit. For example, the on-die test circuit can characterize one or both of the linearity and monotonicity of the digital-to-analog conversion. The value of a conversion output for a digital input code may be compared to the value of a prior conversion output of a prior step to provide digital difference values for each step of a sweep of digital input codes. Digital difference values may be compared to one or more predetermined limits to provide one or more pass/fail tests on-board the die. Other embodiments are described and claimed.

US Patent:

20170038265, Feb 9, 2017

Filed:

Oct 4, 2016

Appl. No.:

15/285405

Inventors:

- Santa Clara CA, US
David E. Duarte - Portland OR, US
Gregory F. Taylor - Portland OR, US

International Classification:

G01K 15/00
G01K 7/00

Abstract:

Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

US Patent:

20170005670, Jan 5, 2017

Filed:

Sep 14, 2016

Appl. No.:

15/265730

Inventors:

- Santa Clara CA, US
George L. Geannopoulos - Portland OR, US
David E. Duarte - Portland OR, US
J. Keith Hodgson - Hillsboro OR, US
James S. Ayers - Portland OR, US
Avner Kornfeld - Portland OR, US
Jonathan P. Douglas - Portland OR, US

International Classification:

H03M 3/00
H03M 1/00
H03M 1/12

Abstract:

Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

US Patent:

20160233879, Aug 11, 2016

Filed:

May 6, 2015

Appl. No.:

14/705805

Inventors:

- Santa Clara CA, US
George L. Geannopoulos - Portland OR, US
David E. Duarte - Portland OR, US
J. Keith Hodgson - Hillsboro OR, US
James S. Ayers - Portland OR, US
Avner Kornfeld - Portland OR, US
Jonathan P. Douglas - Portland OR, US

International Classification:

H03M 3/00
H03M 1/00
H03M 1/12

Abstract:

Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

US Patent:

20140365156, Dec 11, 2014

Filed:

Jun 11, 2013

Appl. No.:

13/915453

Inventors:

David E. Duarte - Portland OR, US
Gregory F. Taylor - Portland OR, US

International Classification:

G01K 15/00

US Classification:

702 99

Abstract:

Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.