Janet M Riley

US Patent:

20140239500, Aug 28, 2014

Filed:

Feb 25, 2013

Appl. No.:

13/775484

Inventors:

- Dallas TX, US
FROMUND METZ - MARZLING, DE
JAN HERMANN PAPE - FREISING, DE
JANET RILEY - HIDEAWAY TX, US

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

H01L 23/00
H01L 21/768

US Classification:

257751, 438653

Abstract:

An integrated circuit (IC) die has a top side surface providing circuitry including active circuitry configured to provide a function, including at least one bond pad formed from a bond pad metal coupled to a node in the circuitry. A dielectric passivation layer is over a top side surface of a substrate providing a contact area which exposes the bond pad. A metal capping layer includes an electrically conductive metal or an electrically conductive metal compound over at least the contact area to provide corrosion protection to the bond pad metal, which is in electrical contact with the bond pad metal. The metal capping layer can extend over structures other than the bond pads, such as to cover at least 80% of the area of the IC die to provide structures on the IC die protection from incident radiation.