Jian Wang

US Patent:

7307959, Dec 11, 2007

Filed:

Apr 12, 2002

Appl. No.:

10/121823

Inventors:

Jian L. Wang - San Jose CA, US

Assignee:

Fujitsu Limited - Kawasaki-shi, Kanagawa

International Classification:

H04L 12/26

US Classification:

370252

Abstract:

A system for locating optical network elements and determining span loss in a network is described. The geographical locations of the first and second network elements in the network are determined with respect to an earth-based coordinate system. A network management system program displays iconic representations of the first and second network elements relative to one another with respect to the coordinate system. The distance between the first and second network elements over a network span linking the two network elements is determined. The transmission loss of the span is determined by multiplying the calculated distance by a transmission loss factor associated with the transmission medium coupling the first and second network elements. The component losses associated with each of the first and second network elements is determined using known specifications or direct measurement. The span loss is determined by adding the component losses with the transmission loss of the medium.

US Patent:

7378253, May 27, 2008

Filed:

Jan 11, 2006

Appl. No.:

11/330768

Inventors:

Douglas Dedera - Castro Valley CA, US
Jian Rui Wang - San Jose CA, US
Peter Emtage - Edmonton, CA

Assignee:

Novelo, Inc. - San Carlos CA

International Classification:

G01N 33/53

US Classification:

435 723, 435 71, 435 721

Abstract:

Certain cells, including types of cancer cells such as lymphomas, are capable of expressing high levels of CD84Hy1. Immunotargeting using CD84Hy1 polypeptides, nucleic acids encoding for CD84Hy1 polypeptides and anti-CD84Hy1 antibodies provides a method of killing or inhibiting that growth of CD84HY1Protein-expressing cancer cells. Methods of immunotherapy and diagnosis of disorders associated with CD84Hy1 protein-expressing cells are described.

US Patent:

7381682, Jun 3, 2008

Filed:

Oct 28, 2005

Appl. No.:

11/260996

Inventors:

Jifei Jia - Mountain View CA, US
Jonathan W. Woo - San Jose CA, US
Jian Wang - San Mateo CA, US
Xianghong Hao - Sunnyvale CA, US

Assignee:

NanoStellar, Inc. - Redwood City CA

International Classification:

B01J 23/40
B01J 23/42
B01J 23/56
B01J 23/00
B01J 21/04

US Classification:

502327, 502332, 502334, 502339, 502355, 502415, 502439

Abstract:

A method for producing highly dispersed catalysts is disclosed. The method includes contacting a support material with a solvent for a period of time, adding a metal salt to the solvent and support mixture, and then adding a reducing agent to the solution to reduce the metal salt to nanometer sized metal particles on the surface of the support. Excess solvent is used in the process, the volume of solvent being greater than two times the pore volume of the support.

US Patent:

7381683, Jun 3, 2008

Filed:

Oct 28, 2005

Appl. No.:

11/261132

Inventors:

Jian Wang - San Mateo CA, US
Xianghong Hao - Sunnyvale CA, US
Jifei Jia - Mountain View CA, US
Jonathan W. Woo - San Jose CA, US

Assignee:

NanoStellar, Inc. - Redwood City CA

International Classification:

B01J 23/00
B01J 21/00
B01J 20/00

US Classification:

502327, 502326, 502330, 502331, 502332, 502333, 502334, 502339, 502344, 502345, 502346, 502347, 502348, 502355, 502415, 502439

Abstract:

Supported catalysts are produced with nanometer sized particles comprised of different metals dispersed throughout the catalyst support material. The supported catalysts reduce substantially or completely the amount of platinum that is required without sacrificing catalytic performance. In place of platinum, the supported catalysts employ palladium, silver, or copper, all of which costs significantly less than platinum.

US Patent:

7527771, May 5, 2009

Filed:

Dec 17, 2004

Appl. No.:

11/016578

Inventors:

Juan Cai - Fremont CA, US
Mats Larsson - Sunnyvale CA, US
Jifei Jia - Mountain View CA, US
Xianghong Hao - Sunnyvale CA, US
Jian Wang - San Mateo CA, US

Assignee:

Nanostellar, Inc. - Redwood City CA

International Classification:

C01B 19/00

US Classification:

423 1, 423 22, 4236585, 502 24, 502334, 502439, 75743, 75744

Abstract:

A sample preparation method for characterization of nanoparticles embedded in the supports of heterogeneous catalysts, with improved particle dispersion, is introduced. The supported catalyst is first ground or milled into fine powder. Then, the powder is mixed into an organic solvent, and an etchant is added to the solvent to digest the supports and release metallic nanoparticles. The resulting solution is then placed in an ultrasonic bath where ultrasonic waves are generated and applied to the solution. The ultrasonic waves suppress agglomeration of the particles and also break up those particle clusters resulting from agglomeration during the prior steps. Subsequently, a sample is extracted from the solution and prepared for analysis.

US Patent:

7981413, Jul 19, 2011

Filed:

Aug 20, 2008

Appl. No.:

12/195282

Inventors:

Chiaoyun Kuo - San Jose CA, US
Bryan J. Boyle - Palo Cedro CA, US
Jian Rui Wang - San Jose CA, US
Y. Tom Tang - San Jose CA, US
Chenghua Liu - Campbell CA, US
Radoje T. Drmanac - Los Altos Hills CA, US

Assignee:

ARCA Biopharma Inc. - Broomfield CO

International Classification:

A61K 39/395

US Classification:

4241301, 5303879, 5303881

Abstract:

The invention provides novel polynucleotides and polypeptides encoded by such polynucleotides and mutants or variants thereof that correspond to a novel human secreted CD84-like polypeptide. These polynucleotides comprise nucleic acid sequences isolated from cDNA library from human spleen (Hyseq clone identification numbers 2938352 (SEQ ID NO: 1)). Other aspects of the invention include vectors containing processes for producing novel human secreted CD84-like polypeptides, and antibodies specific for such polypeptides.

US Patent:

8591261, Nov 26, 2013

Filed:

Aug 1, 2011

Appl. No.:

13/195356

Inventors:

Jaydip Das - Cupertino CA, US
Jian Wang - Fremont CA, US
Na An - Mountain View CA, US
Randy K. Rannow - Reno NV, US
Mark W. Ellsworth - Dublin CA, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

H01R 13/66

US Classification:

43962005, 439676

Abstract:

An electrical connector includes a housing having a plug cavity configured to receive a modular plug therein. A terminal assembly is coupled to the housing. The terminal assembly has a plurality of terminals configured to engage corresponding terminals of the modular plug. The electronic connector includes a magnetic assembly that has a circuit board. The terminals are terminated to the circuit board. The magnetic assembly has magnetic circuits coupled to the circuit board. Each magnetic circuit has a ferrous portion and conductors circumferentially wrapped around the ferrous portion. At least one of the magnetic circuits is coated with a coating material that includes a matrix and filler. The filler can have a higher or lower dielectric constant than the matrix. The dielectric characteristics of the nano-composite can be tuned by varying the concentrations of the filler and matrix material. This tunable nano-composite can serve as an additional design knob for better impedance matching for the magnetic connectors over a wide frequency range.

US Patent:

20060049056, Mar 9, 2006

Filed:

Apr 11, 2003

Appl. No.:

10/510656

Inventors:

Hui Wang - Fremont CA, US
Jian Wang - Fremont CA, US
Peihaur Yih - Boonton NJ, US
Huiquan Wu - Rockville MD, US

Assignee:

ACM Research, Inc. - Fremont CA

International Classification:

C25D 7/12

US Classification:

205123000, 205157000

Abstract:

In one aspect of the present invention, an exemplary method is provided for electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recessed regions within a first current density range before the metal layer is planar above recessed regions of a first density, and electroplating within a second current density range after the metal layer is planar above the recessed regions. The second current density range is greater than the first current density range. In one example, the method further includes electroplating in the second current density range until the metal layer is planar above recessed regions of a second density, the second density being greater than the first density, and electroplating within a third current density range thereafter.

Address:

3265 Fls Crk Dr, San Jose, CA 95135

Phone:

(408)5319280

VIN:

JN8AS5MT3CW289865

Make:

NISSAN

Model:

ROGUE

Year:

2012