Jian Y Wang

US Patent:

7378253, May 27, 2008

Filed:

Jan 11, 2006

Appl. No.:

11/330768

Inventors:

Douglas Dedera - Castro Valley CA, US
Jian Rui Wang - San Jose CA, US
Peter Emtage - Edmonton, CA

Assignee:

Novelo, Inc. - San Carlos CA

International Classification:

G01N 33/53

US Classification:

435 723, 435 71, 435 721

Abstract:

Certain cells, including types of cancer cells such as lymphomas, are capable of expressing high levels of CD84Hy1. Immunotargeting using CD84Hy1 polypeptides, nucleic acids encoding for CD84Hy1 polypeptides and anti-CD84Hy1 antibodies provides a method of killing or inhibiting that growth of CD84HY1Protein-expressing cancer cells. Methods of immunotherapy and diagnosis of disorders associated with CD84Hy1 protein-expressing cells are described.

US Patent:

7381682, Jun 3, 2008

Filed:

Oct 28, 2005

Appl. No.:

11/260996

Inventors:

Jifei Jia - Mountain View CA, US
Jonathan W. Woo - San Jose CA, US
Jian Wang - San Mateo CA, US
Xianghong Hao - Sunnyvale CA, US

Assignee:

NanoStellar, Inc. - Redwood City CA

International Classification:

B01J 23/40
B01J 23/42
B01J 23/56
B01J 23/00
B01J 21/04

US Classification:

502327, 502332, 502334, 502339, 502355, 502415, 502439

Abstract:

A method for producing highly dispersed catalysts is disclosed. The method includes contacting a support material with a solvent for a period of time, adding a metal salt to the solvent and support mixture, and then adding a reducing agent to the solution to reduce the metal salt to nanometer sized metal particles on the surface of the support. Excess solvent is used in the process, the volume of solvent being greater than two times the pore volume of the support.

US Patent:

7381683, Jun 3, 2008

Filed:

Oct 28, 2005

Appl. No.:

11/261132

Inventors:

Jian Wang - San Mateo CA, US
Xianghong Hao - Sunnyvale CA, US
Jifei Jia - Mountain View CA, US
Jonathan W. Woo - San Jose CA, US

Assignee:

NanoStellar, Inc. - Redwood City CA

International Classification:

B01J 23/00
B01J 21/00
B01J 20/00

US Classification:

502327, 502326, 502330, 502331, 502332, 502333, 502334, 502339, 502344, 502345, 502346, 502347, 502348, 502355, 502415, 502439

Abstract:

Supported catalysts are produced with nanometer sized particles comprised of different metals dispersed throughout the catalyst support material. The supported catalysts reduce substantially or completely the amount of platinum that is required without sacrificing catalytic performance. In place of platinum, the supported catalysts employ palladium, silver, or copper, all of which costs significantly less than platinum.

US Patent:

7527771, May 5, 2009

Filed:

Dec 17, 2004

Appl. No.:

11/016578

Inventors:

Juan Cai - Fremont CA, US
Mats Larsson - Sunnyvale CA, US
Jifei Jia - Mountain View CA, US
Xianghong Hao - Sunnyvale CA, US
Jian Wang - San Mateo CA, US

Assignee:

Nanostellar, Inc. - Redwood City CA

International Classification:

C01B 19/00

US Classification:

423 1, 423 22, 4236585, 502 24, 502334, 502439, 75743, 75744

Abstract:

A sample preparation method for characterization of nanoparticles embedded in the supports of heterogeneous catalysts, with improved particle dispersion, is introduced. The supported catalyst is first ground or milled into fine powder. Then, the powder is mixed into an organic solvent, and an etchant is added to the solvent to digest the supports and release metallic nanoparticles. The resulting solution is then placed in an ultrasonic bath where ultrasonic waves are generated and applied to the solution. The ultrasonic waves suppress agglomeration of the particles and also break up those particle clusters resulting from agglomeration during the prior steps. Subsequently, a sample is extracted from the solution and prepared for analysis.

US Patent:

20040006601, Jan 8, 2004

Filed:

Jul 1, 2002

Appl. No.:

10/187537

Inventors:

David Bernstein - San Francisco CA, US
Jerry Wang - San Jose CA, US
Jian Wang - Saratoga CA, US
David Coelho - Los Altos Hills CA, US

International Classification:

G06F015/16

US Classification:

709/207000

Abstract:

An optimized persistent messaging method and system repeatedly attempts delivery of a message by alternate delivery services that are capable of delivering a message if delivery by an initial delivery service fails, until either delivery is successful or else attempted delivery by all the delivery services has failed. The optimized persistent messaging method and system also prioritizes delivery services that are capable of delivering a message according to prioritization criteria from a variety of possible sources. The optimized persistent messaging method and system repeatedly attempts delivery beginning with the highest ranked delivery service and descending down a prioritized list of delivery services, until either delivery is successful or else attempted delivery by all the delivery services has failed.

US Patent:

20050053565, Mar 10, 2005

Filed:

Sep 9, 2003

Appl. No.:

10/658211

Inventors:

Florian Lang - Tuebingen, DE
David Pearce - San Francisco CA, US
Jian Wang - Danville CA, US
James McCormick - San Francisco CA, US

International Classification:

G01N033/53
A61K007/06
A61K007/11

US Classification:

424070140, 435007100

Abstract:

The present invention relates to methods for identifying a hair growth modulating substance, to methods for preparing a pharmaceutical/cosmetic composition for treatment of hair growth disorders, to methods for treating a human being affected by a hair growth disorder, to hair growth modulating substances, to compositions comprising a substance which modulates the activity of SGK3 or causes a modulation of the activity of a SGK3-derived peptide in the above-mentioned “identifying” methods, and to a transgenic non-human sgk3 animal for investigating hair growth disorders.

US Patent:

20060049056, Mar 9, 2006

Filed:

Apr 11, 2003

Appl. No.:

10/510656

Inventors:

Hui Wang - Fremont CA, US
Jian Wang - Fremont CA, US
Peihaur Yih - Boonton NJ, US
Huiquan Wu - Rockville MD, US

Assignee:

ACM Research, Inc. - Fremont CA

International Classification:

C25D 7/12

US Classification:

205123000, 205157000

Abstract:

In one aspect of the present invention, an exemplary method is provided for electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recessed regions within a first current density range before the metal layer is planar above recessed regions of a first density, and electroplating within a second current density range after the metal layer is planar above the recessed regions. The second current density range is greater than the first current density range. In one example, the method further includes electroplating in the second current density range until the metal layer is planar above recessed regions of a second density, the second density being greater than the first density, and electroplating within a third current density range thereafter.

US Patent:

20070125661, Jun 7, 2007

Filed:

Feb 23, 2005

Appl. No.:

10/590460

Inventors:

Hui Wang - Fremont CA, US
Afnan Muhammed - Fremont CA, US
Jian Wang - Fremont CA, US
Felix Gutman - San Jose CA, US
Frederick Ho - San Jose CA, US

Assignee:

ACM RESEARCH INC. - FREMONT CALIFORNIA CA

International Classification:

B23H 3/00

US Classification:

205651000

Abstract:

A metal layer formed on a wafer, the wafer having a center portion and an edge portion, is electropolished by aligning a nozzle and the wafer to position the nozzle adjacent to the center portion of the wafer. The wafer is rotated. As the wafer is rotated, a stream of electrolyte is applied from the nozzle onto a portion of the metal layer adjacent to the center portion of the wafer to begin to electropolish the portion of the metal layer with a triangular polishing profile to initially expose an underlying layer underneath the metal layer at a point.