John Robert Conner

Address:

588 Stephens Rd, Akron, OH 44312

Phone:

(330)7945801

VIN:

1FTYR44U97PA05387

Make:

FORD

Model:

RANGER

Year:

2007

Address:

696 San Moritz Dr, Akron, OH 44333

VIN:

1J8GR48K47C652123

Make:

JEEP

Model:

GRAND CHEROKEE

Year:

2007

Address:

167 Overwood Rd, Akron, OH 44313

VIN:

JTEBU14R870111963

Make:

TOYOTA

Model:

4 RUNNER

Year:

2007

US Patent:

7358444, Apr 15, 2008

Filed:

Oct 13, 2004

Appl. No.:

10/964790

Inventors:

Robert M. Nickerson - Chandler AZ, US
Ronald L. Spreitzer - Phoenix AZ, US
John C. Conner - Chandler AZ, US
Brian Taggart - Phoenix AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 1/00

US Classification:

174254, 361748

Abstract:

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

US Patent:

7375978, May 20, 2008

Filed:

Dec 23, 2003

Appl. No.:

10/746595

Inventors:

John Conner - Chandler AZ, US
Brian Taggart - Phoenix AZ, US
Robert Nickerson - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 1/11
H05K 1/14

US Classification:

361794, 361777, 361778

Abstract:

Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention are described in the claims.

US Patent:

7818878, Oct 26, 2010

Filed:

Mar 4, 2008

Appl. No.:

12/042222

Inventors:

Robert M. Nickerson - Chandler AZ, US
Ronald L. Spreitzer - Phoenix AZ, US
John C. Conner - Chandler AZ, US
Brian Taggart - Phoenix AZ, US

Assignee:

INTEL Corporation - Santa Clara CA

International Classification:

H05K 3/30

US Classification:

29835, 29831, 29840, 29841, 174261, 257686

Abstract:

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

US Patent:

46916920, Sep 8, 1987

Filed:

Dec 5, 1985

Appl. No.:

6/804828

Inventors:

Leo B. Conner - Phoenix AZ
John M. Conner - Mesa AZ

International Classification:

F24J 240

US Classification:

126422

Abstract:

A solar energy system in which a heat transferring liquid captures heat in solar collectors and stores it in a storage tank is disclosed. A pump moves heat transferring liquid from the storage tank to the collectors and into a drain-back module only when a predetermined activation temperature is achieved. The pump then inactivates allowing heat transferring liquid within the collectors to heat. When the pump initially inactivates, a siphon or draining cycle is formed which moves heat transferring liquid from the drain-back module to the storage tank. Gas within the storage tank replaces heat transferring liquid in the collectors through the drain-back module to achieve drain-back. However, the siphon or draining operation must first cause heat transferring liquid within the drain-back module to fall below a drain-back feed point. Thus, the solar energy system delays drain-back until after the siphon or draining operation is completed.