John F Robichaud

US Patent:

62618679, Jul 17, 2001

Filed:

Mar 13, 1998

Appl. No.:

9/039058

Inventors:

John R. Robichaud - Seekonk MA
Raymond Duff - North Dartmouth MA
Donald C. Taber - Berkley MA

Assignee:

Stratedge Corporation - San Diego CA

International Classification:

H01L 2144
H01L 2148
H01L 2150
H01L 2306

US Classification:

438118

Abstract:

A package for a microelectronic device, and a method for making the package, include a thermally conductive base containing a metal composite including a high conductivity metal and a ferrous alloy, the base having a surface with an iron oxide deposit disposed thereon. An insulating substrate is disposed on the surface of the base, the substrate having an aperture formed therein for exposing a portion of the surface of the base for mounting the device on the base. A conductive lead has a portion thereof embedded within the insulating substrate and is adapted to be electrically connected to the device. The insulating substrate is bonded to the iron oxide deposit disposed on the surface of the base, such as by heating.