Juliet Marie Sanchez

US Patent:

20140030509, Jan 30, 2014

Filed:

Mar 14, 2013

Appl. No.:

13/827117

Inventors:

Juliet Grace Sanchez - Carson CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C09J 9/02

US Classification:

428328, 252514

Abstract:

A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ≦250 C. without the application of pressure.

US Patent:

20210092884, Mar 25, 2021

Filed:

Sep 30, 2020

Appl. No.:

17/039102

Inventors:

- Duesseldorf, DE
Daniel Maslyk - Rancho Santa Margarita CA, US
Qizhuo Zhuo - Irvine CA, US
Juliet Grace Sanchez - Carson CA, US

International Classification:

H05K 9/00
H05K 1/02
H01L 23/552
H01L 21/78

Abstract:

A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.

US Patent:

20200084924, Mar 12, 2020

Filed:

Nov 12, 2019

Appl. No.:

16/680621

Inventors:

- Duesseldorf, DE
Daniel Maslyk - Rancho Santa Margarita CA, US
Qizhuo Zhuo - Irvine CA, US
Juliet Grace Sanchez - Carson CA, US

International Classification:

H05K 9/00
H05K 1/02

Abstract:

A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.

US Patent:

20190206805, Jul 4, 2019

Filed:

Mar 8, 2019

Appl. No.:

16/296841

Inventors:

- Duesseldorf, DE
Juliet G. SANCHEZ - Carson CA, US
Xinpei CAO - Irvine CA, US
Qizhuo ZHUO - Irvine CA, US

International Classification:

H01L 23/552
C08G 73/06

Abstract:

Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.

US Patent:

20160151864, Jun 2, 2016

Filed:

Feb 8, 2016

Appl. No.:

15/017755

Inventors:

- Duesseldorf, DE
Harry Richard Kuder - Fullerton CA, US
Juliet Grace Sanchez - Carson CA, US
Albert P. Perez - La Habra CA, US
Kathryn Bearden - Aliso Viejo CA, US

International Classification:

B23K 35/30
B23K 35/362
B23K 35/26
C22C 38/52
C22C 9/00
C22C 38/04
C22C 38/02
C22C 38/00
C22C 13/00
C22C 5/06
B23K 35/02
C22C 38/06

Abstract:

A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy.