Kathleen M Rhoads

US Patent:

51659867, Nov 24, 1992

Filed:

Jun 5, 1991

Appl. No.:

7/710559

Inventors:

Robert D. Gardner - Northfield OH
Kathleen M. Rhoads - Seville OH
Raymond F. Babuder - Fairview Park OH

Assignee:

Ferro Corporation - Cleveland OH

International Classification:

B32B 900

US Classification:

428209

Abstract:

Aluminum nitride (AIN), due to its high thermal conductivity, is an attractive substrate material to the power hybrid market, (i. e. , users employing circuits utilizing power semiconductors resulting in a great deal of heat being produced by the electronic device). In spite of its attractive thermal, mechanical and dielectric properties, AlN substrates generally afford certain drawbacks, the primary drawback being that many conductive compositions do not readily adhere to the surface. One of the more desirable conductors to utilize in conductive compositions when producing microcircuits is copper. In accordance with the present invention, a copper containing conductive composition is provided which affords excellent adhesion to AlN substrates. The conductive composition preferably comprises copper or a copper alloy, a glass binder, and cadmium oxide.