Kevin W Cheek

US Patent:

6841080, Jan 11, 2005

Filed:

Jan 28, 2003

Appl. No.:

10/352483

Inventors:

Angus Kingon - Cary NC, US
Gregory J. Dunn - Arlington Heights IL, US
Stephen Streiffer - Oak Park IL, US
Kevin Cheek - Raleigh NC, US
Jon-Paul Maria - Raleigh NC, US
Jovica Savic - Downers Grove IL, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01G 1300
H01G 400
H01G 500
H01G 700
H01G 900

US Classification:

216 6, 29 2503

Abstract:

A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples of barrier layers include Ni—P or Ni—Cr alloys. After a second layer of conductive metal is deposited on a dielectric oxide surface opposing the first conductive metal layer, the resulting capacitor foil is processed into a capacitor. The resulting capacitor is a surface mounted capacitor or is formed as a integrated or embedded capacitor within a circuit board.

US Patent:

6541137, Apr 1, 2003

Filed:

Jul 31, 2000

Appl. No.:

09/629504

Inventors:

Angus Kingon - Cary NC
Gregory J. Dunn - Arlington Heights IL
Stephen Streiffer - Oak Park IL
Kevin Cheek - Raleigh NC
Jon-Paul Maria - Raleigh NC
Jovica Savic - Downers Grove IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B32B 900

US Classification:

428701, 428702, 428699, 338226

Abstract:

A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples of barrier layers include NiâP or NiâCr alloys. After a second layer of conductive metal is deposited on a dielectric oxide surface opposing the first conductive metal layer, the resulting capacitor foil is processed into a capacitor. The resulting capacitor is a surface mounted capacitor or is formed as a integrated or embedded capacitor within a circuit board.