Khanh N Tran

US Patent:

20230048030, Feb 16, 2023

Filed:

Jan 12, 2021

Appl. No.:

17/794373

Inventors:

- Hickory NC, US
Paul EVEREST - Flower Mound TX, US
Joy HUANG - Plano TX, US
Khanh Duy TRAN - Rowlett TX, US
Steven ROGERS - Garland TX, US
Michel DEMBINSKI - Dallas TX, US
Samantha L. MERTA - Richardson TX, US

International Classification:

G09F 3/18
G09F 3/02

Abstract:

A coding apparatus is mounted on a jumper cable. The coding apparatus includes a plurality of coding symbols. A selection mechanism is part of the coding apparatus and is operable to reveal a selected plurality of coding symbols of the plurality of coding symbols. The selected plurality of coding symbols, in combination, provide a code identifying a connection location for the jumper cable.

US Patent:

20170214133, Jul 27, 2017

Filed:

Oct 28, 2015

Appl. No.:

15/515471

Inventors:

- Hickory NC, US
Eddie R. BRADLEY - Allen TX, US
Khanh Duy TRAN - Rowlett TX, US

International Classification:

H01Q 1/42
H01Q 1/12
H01Q 15/14

Abstract:

A connector assembly for an antenna which includes an antenna cover. The connector assembly includes a connector mount with one or more connectors and a connector housing enclosing the connectors. The connector mount extends through an opening in the antenna cover with sufficient clearance to allow movement due to difference in thermal expansion between the antenna cover and the antenna structure. The assembly also includes a flexible seal structure attached to the connector mount and attachable to the antenna cover and dimensioned to enclose a portion of the connector mount extending outside the antenna cover to form a flexible weather resistant seal between the antenna cover and the connector mount while allowing movement of the connector mount relative to the antenna cover.

US Patent:

20150155264, Jun 4, 2015

Filed:

Jul 8, 2014

Appl. No.:

14/325573

Inventors:

- San Jose CA, US
Srikanth Kulkarni - Dallas TX, US
Khanh Tran - Milpitas CA, US

International Classification:

H01L 23/00
H01L 21/78

Abstract:

Semiconductor devices are described that employ techniques configured to control adhesive application between a substrate and a die. In an implementation, a sacrificial layer is provided on a top surface of the die to protect the surface, and bonds pads thereon, from spill-over of the adhesive. The sacrificial layer and spill-over adhesive are subsequently removed from the die and/or chip carrier. In an implementation, the die includes a die attach film (DAF) on a bottom surface of the die for adhering the die to the cavity of the substrate. The die is applied to the cavity with heat and pressure to cause a portion of the die attach film (DAF) to flow from the bottom surface of the die to a sloped surface of the substrate cavity.