Lan Chi Duong

US Patent:

7959735, Jun 14, 2011

Filed:

Feb 8, 2007

Appl. No.:

11/672955

Inventors:

William N. Sterling - Santa Clara CA, US
Lan Duong - Saratoga CA, US
Gaku Furuta - Sunnyvale CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 16/00
H01L 21/683
H01T 23/00

US Classification:

118728, 361234

Abstract:

A method and apparatus for reducing arcing in a plasma processing system when processing large area substrates which contain one or more holes. In one embodiment of the invention, a substrate support member includes an electrically insulating insert located beneath a hole in an insulating, large area substrate. The insulating insert is made of aluminum oxide, and is located within a hole in the support member such that the insert is disposed beneath a hole in a glass substrate. The substrate support member is made of aluminum with an anodized surface.

US Patent:

8251009, Aug 28, 2012

Filed:

May 13, 2009

Appl. No.:

12/465037

Inventors:

Lan Duong - Saratoga CA, US
William N. Sterling - Santa Clara CA, US
John M. White - Hayward CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B05C 13/00

US Classification:

118500, 118728, 15634551, 29464, 269289 R

Abstract:

The present invention generally includes a shadow frame with alignment inserts that may permit the shadow frame to be properly aligned on the susceptor. The shadow frame may have one or more alignment inserts. The alignment inserts may be coupled to a cavity formed in the bottom surface of the shadow frame. The alignment inserts may be shaped to receive an alignment button that may be present on the susceptor. Thus, as the susceptor raises to the processing position and retrieves the shadow frame, the shadow frame may align properly on the susceptor.