Larry A Mayes

US Patent:

7479399, Jan 20, 2009

Filed:

May 21, 2007

Appl. No.:

11/804896

Inventors:

Mark Alan Johnson - Portland ME, US
Larry W. Mayes - Lewiston ME, US

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L 21/00

US Classification:

438 33, 438 68, 438113, 438118, 438460, 438464, 438FOR 386, 267620, 267E23179

Abstract:

A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated diamond sawing tool to expose a cross sectional view of the sample wafer. The sample wafer is removed from the first support stub and rotated to orient the sample wafer for plan view imaging. The rotated sample wafer is then remounted on a second support stub and cut with the automated diamond sawing tool to expose a plan view surface of the rotated sample wafer. The remounted sample wafer is subsequently prepared for focused ion beam (FIB) milling and plan view transmission electron microscopy imaging.

US Patent:

7250318, Jul 31, 2007

Filed:

Jul 30, 2004

Appl. No.:

10/903367

Inventors:

Mark Alan Johnson - Portland ME, US
Larry W. Mayes - Lewiston ME, US

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L 21/00

US Classification:

438 33, 438 68, 438113, 438118, 438460, 438464, 438FOR 386, 257620, 257E23179, 372 46012

Abstract:

A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated diamond sawing tool to expose a cross sectional view of the sample wafer. The sample wafer is removed from the first support stub and rotated to orient the sample wafer for plan view imaging. The rotated sample wafer is then remounted on a second support stub and cut with the automated diamond sawing tool to expose a plan view surface of the rotated sample wafer. The remounted sample wafer is subsequently prepared for focused ion beam (FIB) milling and plan view transmission electron microscopy imaging.