Mark A Conti

US Patent:

20080308300, Dec 18, 2008

Filed:

Jun 16, 2008

Appl. No.:

12/139892

Inventors:

Mark A. Conti - Waterbury CT, US
Raymond E. Stupak - Litchfield CT, US
Ronald D. Gross - Storrs CT, US

International Classification:

H05K 1/09
B05D 5/12

US Classification:

174250, 427 976

Abstract:

A silver layer () is sandwiched between a tin layer () and a tin top coat () on an electrically-conductive substrate () which may comprise copper. The substrate having the three discrete metal layers thereon is heated to a temperature of at least about 220 C., preferably from about 220 C. to about 410 C., to melt the three layers. The melted layers are cooled to cause them to re-solidify as a tin-silver alloy layer () in which the silver is fully dispersed. A coated electrically conductive substrate () made as described above may be used as an electrical contact material.