Martin Alan Baker

US Patent:

61897663, Feb 20, 2001

Filed:

Jul 10, 1998

Appl. No.:

9/112429

Inventors:

Martin L. Baker - Burnsville NC
William F. Cashion - Oviedo FL
Fred B. Hagedorn - Orlando FL

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G23K 119

US Classification:

228121

Abstract:

A multi-layer structure including a first layer; a second layer, with a coefficient of thermal expansion different than a coefficient of thermal expansion of the first layer, a bulk modulus different than a bulk modulus of the first layer and a thermal conductivity different than a thermal conductivity of the first layer; a bonding layer, having an isostatic pressure versus temperature curve with one of the first layer and the second layer which is substantially similar to an isostatic pressure versus temperature curve of the first layer and the second layer, such that a substantially stress-free bond is formed between the first layer and the second layer; wherein the first layer, the second layer, and the bonding layer are arranged as a sandwich, with the bonding layer in between the first layer and the second layer. The bonding layer may also be optional, in principle, and the first layer and the second layer bonded by diffusion, if the first layer and the second layer have sufficiently low melting temperatures.