Martin M Goldberg

US Patent:

58008586, Sep 1, 1998

Filed:

Sep 12, 1996

Appl. No.:

8/711894

Inventors:

Harry Randall Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Donald G. McBride - Binghamton NY
Terrence Robert O'Toole - Webster NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 512

US Classification:

427 97

Abstract:

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

US Patent:

53744543, Dec 20, 1994

Filed:

Feb 4, 1993

Appl. No.:

8/013652

Inventors:

Harry R. Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin J. Goldberg - Mahopac NY
Voya R. Markovich - Endwell NY
Linda C. Matthew - Peekskill NY
Donald G. McBride - Binghampton NY
Terrence R. O'Toole - Hopewell Junction NY
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Stormville NY

Assignee:

International Business Machines Incorporated - Armonk NY

International Classification:

B05D 100

US Classification:

427306

Abstract:

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

US Patent:

57308900, Mar 24, 1998

Filed:

Sep 12, 1996

Appl. No.:

8/715376

Inventors:

Harry Randall Bickford - Ossining NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

Internationl Business Machines Corporation - Armonk NY

International Classification:

B44C 122

US Classification:

216 87

Abstract:

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

US Patent:

58741542, Feb 23, 1999

Filed:

Sep 12, 1996

Appl. No.:

8/711865

Inventors:

Harry Randall Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Donald G. McBride - Binghamton NY
Terrence Robert O'Toole - Webster NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 324
B32B 1508

US Classification:

428131

Abstract:

A structure including a halogenated polymeric-containing layer. At least a portion of a surface of the halogenated polymeric-containing layer is electrochemically reduced. An electrically conductive pattern is provided over at least a portion of the electrochemically reduced portion of the halogenated polymeric-containing layer.

US Patent:

57099065, Jan 20, 1998

Filed:

Jun 16, 1995

Appl. No.:

8/490930

Inventors:

Harry Randall Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Donald G. McBride - Binghamton NY
Terrence Robert O'Toole - Webster NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 304

US Classification:

427306

Abstract:

A method of treating a halogenated polymeric-containing substrate including exposing at least portions of the halogenated polymeric-containing substrate to a composition containing a reducing agent and an aprotic solvent selected from the group consisting of nitriles, nitro compounds, amides, esters, carbonates, oxides, sulfo compounds and mixtures thereof. The solvent is free of ethers, amines, ammonia. The composition is prepared by reacting a metal with an organic compound selected from the group consisting of polyaryl compounds, aromatic carbonyl containing compounds, aromatic nitriles, and aromatic heterocyclic nitrogen containing compounds in a reaction solvent that does not react with the metal but permits reaction between the metal and the organic compound to thereby provide the reducing agent. The reducing agent is isolated from the reaction solvent to obtain a reaction product as a solid. The reaction product is added to the aprotic solvent.