Michael S Brooks

Address:

2500 Sunline Dr, Reno, NV 89523

Phone:

(775)7876385

VIN:

4S4BP61C276315305

Make:

SUBARU

Model:

OUTBACK

Year:

2007

US Patent:

8089142, Jan 3, 2012

Filed:

Feb 13, 2002

Appl. No.:

10/075422

Inventors:

Michael Brooks - Caldwell ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 23/02

US Classification:

257686, 257685, 257777, 257784

Abstract:

An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.

US Patent:

8476117, Jul 2, 2013

Filed:

Jan 3, 2012

Appl. No.:

13/342876

Inventors:

Michael Brooks - Caldwell ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/58

US Classification:

438123, 438106, 438109, 257686, 257E21505

Abstract:

An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.

US Patent:

D3695280, May 7, 1996

Filed:

Jan 31, 1995

Appl. No.:

D/034266

Inventors:

Michael C. Brooks - Carson City NV

US Classification:

D7631