Michael Harold Fischer

US Patent:

6642078, Nov 4, 2003

Filed:

Aug 13, 2001

Appl. No.:

09/928974

Inventors:

Bahman Roozrokh - Casselberry FL
Michael E. Fischer - Casselberry FL

Assignee:

Transpo Electronics, Inc. - Orlando FL

International Classification:

H01L 2144

US Classification:

438107, 438121, 438909

Abstract:

A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.

US Patent:

7060533, Jun 13, 2006

Filed:

Jul 16, 2003

Appl. No.:

10/620552

Inventors:

Bahman Roozrokh - Casselberry FL, US
Michael E. Fischer - Casselberry FL, US

Assignee:

Wetherill Associates, Inc. - Royersford PA

International Classification:

H01L 21/52

US Classification:

438115, 438121, 438122

Abstract:

A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.

US Patent:

7116021, Oct 3, 2006

Filed:

Dec 16, 2003

Appl. No.:

10/737539

Inventors:

Michael Fischer - Casselberry FL, US
An Huu Nguyen - Orlando FL, US
Gary Morrissette - Groveland FL, US

Assignee:

Wetherill Associates, Inc. - Royersford PA

International Classification:

H02K 7/00

US Classification:

310 68D, 363141

Abstract:

A charging system includes an alternator body, rotor coil and stator windings. A bridge rectifier is positioned within the alternator body and connected to the stator windings for rectifying the electrical output from the stator windings. The rectifier includes a positive and negative heat sinks each having a top surface and spaced from each other with cooling fins on an outer surface of each heat sink. A plurality of diodes are positioned at each top surface of positive and negative heat sinks. A terminal assembly interconnects respective pairs of positive and negative diodes. At least one pair of interconnected positive and negative diodes are positioned offset from each other at an angle to provide a maximum surface area for the cooling fins.