Michael James Makowski

US Patent:

20220415791, Dec 29, 2022

Filed:

Jun 24, 2021

Appl. No.:

17/357773

Inventors:

- Santa Clara CA, US
Michael James MAKOWSKI - Beaverton OR, US
Benjamin KRIEGEL - Portland OR, US
Robert JOACHIM - Beaverton OR, US
Desalegne B. TEWELDEBRHAN - Sherwood OR, US
Charles H. WALLACE - Portland OR, US
Tahir GHANI - Portland OR, US
Mohammad HASAN - Aloha OR, US

International Classification:

H01L 23/528
H01L 23/522
H01L 21/768

Abstract:

Embodiments of the disclosure are in the field of integrated circuit structure fabrication. In an example, an integrated circuit structure includes a dielectric material structure having a trench therein. A conductive interconnect line in the trench, the conductive interconnect line having a length and a width, the width having a cross-sectional profile, wherein the cross-sectional profile of the width of the conductive interconnect line has a bottom lateral width, a mid-height lateral width, and a top lateral width, and wherein the mid-height lateral width is greater than the bottom lateral width, and the mid-height lateral width is greater than the top lateral width.