Michael T. McClure - Winter Park FL, US Jack Chocola - Lake Mary FL, US Kevin K. Lin - Apopka FL, US George Grama - Oviedo FL, US
Assignee:
Sawtek, Inc. - Orlando FL
International Classification:
H01L 41/08
US Classification:
310313R, 310340, 310344
Abstract:
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.
Wafer Level Packaging Of Materials With Different Coefficients Of Thermal Expansion
Michael T. McClure - Winter Park FL, US Jack Chocola - Lake Mary FL, US Kevin K. Lin - Apopka FL, US George Grama - Oviedo FL, US
Assignee:
Triquint Semiconductor, Inc. - Orlando FL
International Classification:
H01L 21/46 H01L 21/30
US Classification:
438455, 438106, 438456, 438458, 438459, 438464
Abstract:
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.
Isbn (Books And Publications)
Scratching the Beat Surface: Essays on New Vision from Blake to Kerouac
Orthopedic Associates Pc 65 Pennsylvania Ave STE 1, Binghamton, NY 13903 (607)7235393 (phone), (607)7232186 (fax)
Education:
Medical School University of Pittsburgh School of Medicine Graduated: 1971
Procedures:
Hip/Femur Fractures and Dislocations Knee Arthroscopy Arthrocentesis Carpal Tunnel Decompression Hip Replacement Joint Arthroscopy Knee Replacement Lower Arm/Elbow/Wrist Fractures and Dislocations Lower Leg/Ankle Fractures and Dislocations Shoulder Surgery
Conditions:
Fractures, Dislocations, Derangement, and Sprains Internal Derangement of Knee Cartilage Hallux Valgus Internal Derangement of Knee Internal Derangement of Knee Ligaments
Languages:
Chinese English Spanish
Description:
Dr. McClure graduated from the University of Pittsburgh School of Medicine in 1971. He works in Binghamton, NY and specializes in Orthopaedic Surgery. Dr. McClure is affiliated with Binghamton General Hospital and Our Lady Of Lourdes Memorial Hospital Inc.
Trantwood Elementary School Virginia Beach VA 1966-1967, Arlington Heights Elementary School Pascagoula MS 1967-1968, South Elementary School Pascagoula MS 1968-1970, Beach Elementary School Pascagoula MS 1970-1971, Central Elementary School Pascagoula MS 1972-1972, Eastlawn Elementary School Pascagoula MS 1972-1973, William M. Colmer Junior High School Pascagoula MS 1973-1976
I am Michael "Mike" "Scoop" McClure from Dade County. Leisure City/Homestead, FL. any questions? Feel free to drop me a line and get to know me personally. TTYL
Tagline:
NY Born, Miami Raised, Orlando Resident
Bragging Rights:
1992 I Survived Hurricane Andrew in Miami, FL.
Michael Mcclure
Work:
Wyatt Mold Corporation - Press Operator (2012)
Michael Mcclure
Work:
Walt Disney Animation Studios - Sr. Systems Administrator