Peter J. Hopper - San Jose CA Peter Johnson - Sunnyvale CA Kyuwoon Hwang - Palo Alto CA Michael Mian - Livermore CA Robert Drury - Santa Clara CA
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 2900
US Classification:
257528, 257531
Abstract:
The RF impedance of a metal trace at gigahertz frequencies is reduced by forming the metal trace to have a base region and a number of fingers that extend away from the base region. When formed to have a number of loops, the metal trace forms an inductor with an increased Q.
Conductive Trace With Reduced Rf Impedance Resulting From The Skin Effect
Peter J. Hopper - San Jose CA, US Peter Johnson - Sunnyvale CA, US Kyuwoon Hwang - Palo Alto CA, US Michael Mian - Livermore CA, US Robert Drury - Santa Clara CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
The radio frequency (RF) impedance of a metal trace at gigahertz frequencies is reduced by forming the metal trace to have a base region and a number of fins that extend away from the base region. When formed in a spiral configuration having a number of loops, the metal trace forms an inductor with an increased quality factor (Q).
Etched Metal Trace With Reduced Rf Impendance Resulting From The Skin Effect
Peter J. Hopper - San Jose CA, US Peter Johnson - Sunnyvale CA, US Kyuwoon Hwang - Palo Alto CA, US Michael Mian - Livermore CA, US Robert Drury - Santa Clara CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L023/48
US Classification:
257758, 257750, 257774
Abstract:
The RF impedance of a metal trace at gigahertz frequencies is reduced by forming the metal trace to have a base region and a number of fingers that extend away from the base region. When formed to have a number of loops, the metal trace forms an inductor with an increased Q.
Spin-Polarization Of Carriers In Semiconductor Materials For Spin-Based Microelectronic Devices
Vladislav Vashchenko - Palo Alto CA, US Michael Mian - Livermore CA, US Peter J. Hopper - San Jose CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L029/82
US Classification:
257421, 257252, 257427
Abstract:
Spin-based microelectronic devices can be realized by utilizing spin-polarized ferromagnetic materials positioned near, or embedded in, a semiconductor channel of a microelectronic device. Applying an electric field across the channel can cause carriers flowing through the channel to deviate toward one of the ferromagnetic materials, such that the spin of the carriers tends to align with the spin polarization of the respective material. Such a process allows for the controlled spin-polarization of carriers in a semiconductor channel, and hence the development of spin-based microelectronics, without having to inject spin-polarized carriers from a ferromagnet into a semiconductor channel. Such a process avoids the Schottky barrier problem plaguing existing approaches to spin-based microelectronics, while allowing the devices to be based on silicon substrates that are well-known and used in the industry.
An imaging cell reduces recombination losses and increases sensitivity by forming a low resistance lateral path with a silicon germanium layer of a conductivity type that is sandwiched between silicon layers of the same conductivity type. The silicon germanium layer also provides a quantum well from which photo-generated electrons find it difficult to escape, thereby providing a barrier that reduces cross-talk.
Spin-Injection Devices On Silicon Material For Conventional Bicmos Technology
Vladislav Vashchenko - Palo Alto CA, US Michael Mian - Livermore CA, US Peter J. Hopper - San Jose CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L029/66
US Classification:
257213, 257295
Abstract:
Spin-based microelectronic devices can be realized by utilizing ferromagnetic structures that make good ohmic contact with silicon, in order to avoid the Schottky barrier problem plaguing existing approaches to spin-based microelectronics, while allowing the devices to be based on silicon substrates, which are well-known and used in the industry. Thin layers of metal silicide, such as CoSiand NiSi, are used as an intermediate layer between ferromagnetic contacts, such as cobalt and nickel contacts, and the silicon substrate. The thin silicide layers provide good ohmic contact between the ferromagnetic contacts and silicon, such that spin-polarized carriers can be injected into the silicon, and detected out of the silicon, without loss of spin polarization.
Peter J. Hopper - San Jose CA, US Michael Mian - Livermore CA, US Jim McGinty - East Kilbride, GB Robert Drury - Santa Clara CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
G01L 9/00
US Classification:
73754, 257415
Abstract:
A pressure sensing system formed in a monolithic semiconductor substrate. The pressure sensing system comprises a pressure sensing device formed on the monolithic semiconductor substrate. Pressure sensing device is adapted to be disposed in an environment for developing an electrical pressure signal corresponding to the pressure in the environment. The system includes driver circuitry formed in the monolithic semiconductor substrate. The driver circuitry is responsive to input electrical signal for generating an output pressure signal. A conductive interconnect structure formed in the monolithic semiconductor substrate to electrically connects the pressure sensing device to the driver circuitry such that electrical pressure signals developed by the pressure sensing device are provided as input electrical signals to the driver circuitry.
Method Of Making Spin-Injection Devices On Silicon Material For Conventional Bicmos Technology
Vladislav Vashchenko - Palo Alto CA, US Michael Mian - Livermore CA, US Peter J. Hopper - San Jose CA, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 21/00
US Classification:
438 3, 438308
Abstract:
Spin-based microelectronic devices can be realized by utilizing ferromagnetic structures that make good ohmic contact with silicon, in order to avoid the Schottky barrier problem plaguing existing approaches to spin-based microelectronics, while allowing the devices to be based on silicon substrates, which are well-known and used in the industry. Thin layers of metal silicide, such as CoSiand NiSi, are used as an intermediate layer between ferromagnetic contacts, such as cobalt and nickel contacts, and the silicon substrate. The thin silicide layers provide good ohmic contact between the ferromagnetic contacts and silicon, such that spin-polarized carriers can be injected into the silicon, and detected out of the silicon, without loss of spin polarization.