Michael Molina

US Patent:

20040058514, Mar 25, 2004

Filed:

Sep 19, 2003

Appl. No.:

10/666649

Inventors:

Michael (Miguel) Molina - Austin TX, US
Michael Molina - Cedar Park TX, US
Joseph Ojeda - Austin TX, US

International Classification:

H01L021/24

US Classification:

438/540000

Abstract:

Computer controlled de-clip-shadow mask removal machine. The present disclosure describes a computer controlled, fully programmable de-clip-shadow mask removal method and system. This method and system is adapted to remove retaining clips (without human contact), separate a shadow mask from a semiconductor wafer after a metal evaporation process, and remove the shadow mask with greater accuracy. The system uses servomotors which precisely control all ranges of motion required to safely and efficiently remove the mask from the wafer thus minimizing potential damages incurred by human contact.