Mohammad H Hussain

US Patent:

20230129232, Apr 27, 2023

Filed:

Dec 22, 2022

Appl. No.:

18/086981

Inventors:

- Dallas TX, US
Wei Zhang - Plano TX, US
Mohammad Waseem Hussain - Irving TX, US
Peter Anthony Fundaro - Dallas TX, US

International Classification:

H01L 23/495
H01L 21/50
H01L 25/065
H01L 25/16
H02M 3/158

Abstract:

A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.

US Patent:

20210257282, Aug 19, 2021

Filed:

Feb 17, 2021

Appl. No.:

17/177910

Inventors:

- Dallas TX, US
Wei Zhang - Plano TX, US
Mohammad Waseem Hussain - Irving TX, US
Peter Anthony Fundaro - Dallas TX, US

International Classification:

H01L 23/495
H02M 3/158
H01L 25/065
H01L 21/50

Abstract:

A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.