Neil F Murray

US Patent:

20050169346, Aug 4, 2005

Filed:

Jan 29, 2004

Appl. No.:

10/767798

Inventors:

Neil Murray - Wixom MI, US
Douglas Benefiel - West Terre Haute IN, US

International Classification:

G01N025/00

US Classification:

374121000

Abstract:

A method for monitoring quality of a weld () being formed between first and second pieces of material (and ) includes the steps of obtaining a thermal image of the weld () being formed by collecting infrared radiation passing through the second piece of material (); and analyzing the obtained thermal image for characteristics indicative of a properly formed weld ().

US Patent:

20060197323, Sep 7, 2006

Filed:

Mar 1, 2005

Appl. No.:

11/069456

Inventors:

Charles Pillsbury - Rochester Hills MI, US
Arnold Herberg - Davisburg MI, US
Neil Murray - Wixom MI, US
Evgeny Rivin - West Bloomfield MI, US
Victor Fey - West Bloomfield MI, US
Ying-Kuo Lee - Troy MI, US
Jagan Surendran - Sterling Heights MI, US

International Classification:

B60R 21/16

US Classification:

280731000, 280728200

Abstract:

An apparatus () for a vehicle includes a steering wheel () and a vehicle occupant protection device () that is mounted to the steering wheel () and is actuatable for helping to protect an occupant of the vehicle. At least a portion of the vehicle occupant protection device () is movable relative to the steering wheel () for actuating an electric device () associated with the vehicle when a force is applied to any one of various locations on the vehicle occupant protection device (). The apparatus () also includes a mechanism () for substantially blocking tilt of the movable portion of the vehicle occupant protection device () relative to the steering wheel () during movement for actuating the electric device ().

US Patent:

62733273, Aug 14, 2001

Filed:

Jun 16, 1999

Appl. No.:

9/334373

Inventors:

Neil Gordon Murray - Wixom MI
Geoffrey A. Wright - Clarkston MI

Assignee:

TRW Inc. - Lyndhurst OH

International Classification:

B23K 120
B23K 3102

US Classification:

228245

Abstract:

A stencil (34) facilitates application of solder material (48) to a circuit board (10) carrying a through-hole component (14, 16, 18, 20, 22) and to which a surface mount component is to be mounted. The stencil (34) has a first surface (38) and a second surface (40). The second surface (40) is engageable to a surface (28) of the circuit board (10) having a plurality of electrically conductive pads (30, 32). At least one first aperture (42) is formed between the first and second surfaces (38, 40)of the stencil (34). The stencil (34) has a first thickness (T1) adjacent the first aperture (42) for depositing a first amount of solder material (48) within the first aperture (42) and around a component lead (24) extending from the through-hole component (14, 16, 18, 20, 22) into the first aperture (42). At least one second aperture (44) is formed between the first and second surfaces (38, 40) of the stencil (34). The stencil (34) has a second thickness (T2), which is less than the first thickness (T1), adjacent the second aperture for depositing a second amount of solder material (48) within the second aperture (44) onto a desired surface mount pad (32) of the circuit board (10).