Nicholas E Morris

US Patent:

20220355263, Nov 10, 2022

Filed:

Jun 30, 2022

Appl. No.:

17/854559

Inventors:

- Wright-Patterson AFB OH, US
Carl J. Thrasher - Beavercreek OH, US
Alexander M. Watson - Dayton OH, US
Nicholas J. Morris - Dayton OH, US
Zachary J. Farrell - Xenia OH, US

International Classification:

B01J 13/08
H01B 1/02
H01B 1/12
H01B 1/08

Abstract:

The present invention relates to articles comprising core shell liquid metal encapsulate networks and methods of using core shell liquid metal encapsulate networks to control AC signals and power. Such method permits the skilled artisan to control the radiation, transmission, reflection and modulation of an AC signal and power. As a result, AC system properties such as operation frequency, polarization, gain, directionality, insertion loss, return loss, and impedance can be controlled under strain.

US Patent:

20210365552, Nov 25, 2021

Filed:

Jul 15, 2021

Appl. No.:

17/376644

Inventors:

- Wright-Patterson AFB OH, US
Christopher E. Tabor - Kettering OH, US
Zachary J. Farrell - Xenia OH, US
Nicholas J. Morris - Dayton OH, US

International Classification:

G06F 21/55
G06F 21/75
H01B 1/08
H01B 1/22

Abstract:

The present invention relates to core shell liquid metal encapsulates comprising multi-functional ligands, networks comprising such encapsulates and processes of making and using such encapsulates and networks. When subjected to strain, such network's conductivity is enhanced, thus allowing the network to serve as a healing agent that restores at least a portion of the conductivity in an adjacent conductor.

US Patent:

20210360782, Nov 18, 2021

Filed:

Jul 28, 2021

Appl. No.:

17/386807

Inventors:

- Wright-Patterson AFB OH, US
Christopher E. Tabor - Kettering OH, US
Zachary J. Farrell - Xenia OH, US
Nicholas J. Morris - Dayton OH, US

International Classification:

H05K 1/02
H05K 1/09
H05K 3/22
H05K 3/10

Abstract:

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

US Patent:

20210287826, Sep 16, 2021

Filed:

Jun 3, 2021

Appl. No.:

17/337874

Inventors:

- Wright-Patterson AFB OH, US
Zachary J. Farrell - Xenia OH, US
Nicholas J. Morris - Dayton OH, US
Megan A. Creighton - Dayton OH, US

International Classification:

H01B 1/02
C23C 26/00

Abstract:

The present invention relates to core shell liquid metal encapsulates comprising and processes of making and using such encapsulates and networks. The shell(s) of such encapsulates employ a palette of materials having widely varied band structures and/or the desired spin pairing and/or bond polarization. Such encapsulates can be designed to respond to one or more stimuli of choice, including but not limited to electromagnetic, thermal, mechanical, photonic, and/or magnetic and are environmentally robust.

US Patent:

20200139329, May 7, 2020

Filed:

Sep 24, 2019

Appl. No.:

16/580652

Inventors:

- Wright-Patterson AFB OH, US
Carl J. Thrasher - Beavercreek OH, US
Alexander M. Watson - Dayton OH, US
Nicholas J. Morris - Dayton OH, US
Zachary J. Farrell - Xenia OH, US

International Classification:

B01J 13/08
H01B 1/02
H01B 1/08
H01B 1/12

Abstract:

The present invention relates to articles comprising core shell liquid metal encapsulate networks and methods of using core shell liquid metal encapsulate networks to control AC signals and power. Such method permits the skilled artisan to control the radiation, transmission, reflection and modulation of an AC signal and power. As a result, AC system properties such as operation frequency, polarization, gain, directionality, insertion loss, return loss, and impedance can be controlled under strain.

US Patent:

20200143955, May 7, 2020

Filed:

Sep 24, 2019

Appl. No.:

16/580601

Inventors:

- Wright-Patterson AFB OH, US
Christopher E. Tabor - Kettering OH, US
Zachary J. Farrell - Xenia OH, US
Nicholas J. Morris - Dayton OH, US

International Classification:

H01B 1/22
H01B 1/08

Abstract:

The present invention relates to core shell liquid metal encapsulates comprising multi-functional ligands, networks comprising such encapsulates and processes of making and using such encapsulates and networks. When subjected to strain, such network's conductivity is enhanced, thus allowing the network to serve as a healing agent that restores at least a portion of the conductivity in an adjacent conductor.

US Patent:

20200146141, May 7, 2020

Filed:

Nov 1, 2019

Appl. No.:

16/671708

Inventors:

- Wright-Patterson AFB OH, US
Christopher E. Tabor - Kettering OH, US
Zachary J. Farrell - Xenia OH, US
Nicholas J. Morris - Dayton OH, US

International Classification:

H05K 1/02
H05K 1/09
H05K 3/22

Abstract:

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider.

US Patent:

20200146142, May 7, 2020

Filed:

Nov 1, 2019

Appl. No.:

16/671750

Inventors:

- Wright-Patterson AFB OH, US
Christopher E. Tabor - Kettering OH, US
Zachary J. Farrell - Xenia OH, US
Nicholas J. Morris - Dayton OH, US
Michelle Ching-Sum Yuen - Beavercreek OH, US

International Classification:

H05K 1/02
H05K 1/09
H05K 3/10

Abstract:

The present invention relates to architected liquid metal networks and processes of making and using same. The predetermined template design technology of such architected liquid metal networks provides the desired spatial control of electrical, electromagnetic, and thermal properties as a function of strain. Thus, resulting in improved overall performance including process ability.