Nicolas Jean Sunderland from 109 Farmview Pl, Venetia, PA 15367, age 55, Phone: (704)8393174

Color Enhancement For Resin Blends
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US Patent:

20030146536, Aug 7, 2003
Filed:

Nov 20, 2002
Appl. No.:

10/300163
Inventors:

Nicolas Sunderland - Evansville IN, US
Sandeep Dhawan - Evansville IN, US
Christopher Hein - Evansville IN, US
Assignee:

General Electric Company
International Classification:

B29C043/32
D01D005/08
US Classification:

264/172170, 264/500000
Abstract:

The use of a sulfonated polyester ionomer in a polyamide or polyester resin blend results in articles having enhanced dyeability, as demonstrated by an enhanced dye pick-up of at least 25% over resin blends without such sulfonated polyester ionomer.

Flame Retardant, Optically Clear Thermoplastic Molding Composition
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US Patent:

20090326129, Dec 31, 2009
Filed:

Jun 30, 2008
Appl. No.:

12/215789
Inventors:

Marina Rogunova - Pittsburgh PA, US
Nicolas Sunderland - Venetia PA, US
Gerald A. DiBattista - McDonald PA, US
International Classification:

C08L 69/00
US Classification:

524419
Abstract:

A flame-retardant, optically clear thermoplastic molding composition is disclosed. The composition contains aromatic polycarbonate resin, a bromine-substituted carbonate oligomer, a phosphorous containing compound and an inorganic salt of perfluoroalkane sulfonic acid in amounts effective to impart to the composition flame resistance that in accordance with UL-94-5V standard is rated A at 3.00 mm and V-0 at 1.5 mm.

Flame Retardant, Optically Clear Thermoplastic Molding Composition
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US Patent:

20110071241, Mar 24, 2011
Filed:

Sep 23, 2009
Appl. No.:

12/565167
Inventors:

Marina Rogunova - Pittsburgh PA, US
Nicolas Sunderland - Venetia PA, US
James P. Mason - Carnegie PA, US
Hans Franssen - Krefeld, DE
Berit Krauter - Neuss, DE
Assignee:

Bayer MaterialScience LLC - Pittsburgh PA
International Classification:

C08K 5/42
C08K 5/521
US Classification:

524127, 524165
Abstract:

The present invention relates to a flame-retardant, optically clear thermoplastic molding composition. The composition contains a A) about 60 pbw to about 97 pbw of a polycarbonate, B) about 1 pbw to about 20 pbw of bromine-substituted oligocarbonate, C) about 1 pbw to about 20 pbw of a phosphorus-containing compound and D) about 0.01 pbw to about 1 pbw of at least one alkali or alkaline-earth salt of perfluoroalkane sulfonic acid and optionally E) about 0.01 to about 1 pbw of a phosphite antioxidant/stabilizer. In accordance with UL-94 standard the flame-retardant, optically clear thermoplastic molding composition is rated 5VA at 3.00 mm and V-0 at 2.3 mm, more preferably V-0 at 1.5 mm according to UL-94.

In Mold Electronic Printed Circuit Board Encapsulation And Assembly
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US Patent:

20190093874, Mar 28, 2019
Filed:

Nov 8, 2018
Appl. No.:

16/184202
Inventors:

- Pittsburgh PA, US
- Warwick RI, US
Mikhail Sagal - Wakefield RI, US
Jessee McCanna - Midland PA, US
Nicolas Sunderland - Venetia PA, US
James Lorenzo - Mars PA, US
Mark Matsco - Monaca PA, US
Kevin Dunay - Bethel Park PA, US
International Classification:

F21V 29/87
F21V 23/00
F21V 29/77
B29C 67/24
F21K 9/23
F21K 9/90
B29L 31/34
B29K 75/00
F21Y 115/10
F21V 31/04
F21Y 105/10
B29K 669/00
Abstract:

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

In Mold Electronic Printed Circuit Board Encapsulation And Assembly
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US Patent:

20160084490, Mar 24, 2016
Filed:

Apr 16, 2014
Appl. No.:

14/784975
Inventors:

- Pittsburgh PA, US
- Narragansett RI, US
Mikhail SAGAL - Wakefield RI, US
Jessee MCCANNA - Midland PA, US
Nicolas SUNDERLAND - Venetia PA, US
James LORENZO - Mars PA, US
Mark MATSCO - Monaca PA, US
Kevin DUNAY - Bethel Park PA, US
International Classification:

F21V 29/87
B29C 67/24
F21V 29/77
F21K 99/00
F21V 23/00
Abstract:

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Nicolas Jean Sunderland