Paul Kent Colangelo

US Patent:

6499629, Dec 31, 2002

Filed:

May 25, 2000

Appl. No.:

09/578366

Inventors:

Paul K. Colangelo - Lawrenceville GA
Peter J. Petrecca - Dunwoody GA
Alan Ramspeck - Cumming GA
Michael Walker - Atlanta GA

Assignee:

Nordson Corporation - Westlake OH

International Classification:

B67D 562

US Classification:

222 61, 2221465, 222504

Abstract:

Apparatus for dispensing viscous liquid, such as hot melt adhesive, includes a manifold, a dispensing module, a heater thermally coupled to the manifold, and thermally insulating cover structure secured around both the module and the manifold. Air gaps are formed between the cover structure and the heated components inside to further reduce heat transfer. The cover structure may also include heat dissipating fins. A supply connector associated with the manifold includes an interior flow passage, an exterior annular recess and at least one port communicating therebetween. A valve includes a valve seat having an orifice and a sealing surface located around the orifice. The valve further includes a valve stem movable between open and closed positions and having a recess in one end and a sealing edge located around the recess. A valve module includes an integrated heating element for providing localized heat to the adhesive immediately prior to dispensing.

US Patent:

7025081, Apr 11, 2006

Filed:

Nov 5, 2002

Appl. No.:

10/288172

Inventors:

Paul K. Colangelo - Lawrenceville GA, US
Peter J. Petrecca - Dunwoody GA, US
Alan Ramspeck - Cumming GA, US
Michael Walker - Atlanta GA, US

Assignee:

Nordson Corporation - Westlake OH

International Classification:

F16K 53/00
B62D 5/62

US Classification:

137341, 137338, 137828, 2221465

Abstract:

Apparatus for dispensing viscous liquid, such as hot melt adhesive, includes a manifold, a dispensing module, a heater thermally coupled to the manifold, and thermally insulating cover structure secured around both the module and the manifold. Air gaps are formed between the cover structure and the heated components inside to further reduce heat transfer. The cover structure may also include heat dissipating fins. A supply connector associated with the manifold includes an interior flow passage, an exterior annular recess and at least one port communicating therebetween. A valve includes a valve seat having an orifice and a sealing surface located around the orifice. The valve further includes a valve stem movable between open and closed positions and having a recess in one end and a sealing edge located around the recess. A valve module includes an integrated heating element for providing localized heat to the adhesive immediately prior to dispensing.