Peng LIN - San Francisco CA, US Lucas Aaron Zaientz - San Mateo CA, US David W. Liu - South San Francisco CA, US
International Classification:
G06F 3/00
US Classification:
710 19
Abstract:
The audio input port and output port of a consumer grade display device is used to detect the status of that device. Status information that can be detected includes whether the display is on or off and whether the display is connected to a designated input source.
Wraparound Assembly For Combination Touch, Handwriting And Fingerprint Sensor
Srinivasan Kodaganallur Ganapathi - Palo Alto CA, US Nicholas Ian Buchan - San Jose CA, US Kurt Edward Petersen - Milpitas CA, US Ravindra V. Shenoy - Dublin CA, US Peng Cheng Lin - Cupertino CA, US Ericson Cheng - Santa Clara CA, US
Assignee:
QUALCOMM MEMS TECHNOLOGIES, INC. - San Diego CA
International Classification:
G06T 1/00 H05K 3/00 H05K 7/00
US Classification:
345501, 361782, 29829
Abstract:
This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
Tony Man - Danville CA Peng Cheng Lin - Cupertino CA
Assignee:
Acquis Technology, Inc. - Mountain View CA
International Classification:
H05K 720
US Classification:
361683, 361686, 361687, 361695, 3647081, 395733
Abstract:
A method for installing memory into a computer module. The method includes providing a used computer module, which comprises a housing to enclose a hard disk drive, a memory module for random access memory devices and a central processing unit coupled to the hard disk drive and coupled to the random access memory. The method also includes removing a top cover from a base of the housing to expose the hard disk drive and the memory module. Thereafter, the hard disk drive is removed from the base of the housing and a second hard disk drive is inserted onto the base. The top cover is reattached to the base of the housing to complete the installation process.
Independent Consultant / Advisor
Consultant
Apple 2015 - 2016
Hardware
Qualcomm 2005 - 2015
Engineering Team Lead
Education:
Oregon State University
Doctorates, Doctor of Philosophy, Philosophy, Mechanical Engineering
San Jose State University
Master of Business Administration, Masters
Skills:
Mems Cross Functional Collaborations Supplier Partnership 3D Interconnect Die Bond Joint Reliability Doe Statistical Process Control Sip Sensor Packaging Wlcsp Bga Supplier Quality Engineering Quality Control Soft Solder Die Attach
Geo Semiconductor
Chief Technology Officer
Omnivision Technologies, Inc. Aug 2017 - Jul 2019
Vice President of Algorithm and Software
Omnivision Technologies, Inc. Nov 2016 - Aug 2017
Senior Director of Algorithm and Software Group
Mediatek Mar 2015 - Nov 2016
Director, Technology
Qualcomm Nov 2012 - Feb 2015
Senior Staff Engineer and Manager
Education:
Peking University
Bachelors, Bachelor of Science, Mathematics
Washington University In St. Louis
Doctorates, Doctor of Philosophy, Mathematics
Peking University
Master of Science, Masters, Mathematics
Skills:
Image Processing Algorithms Digital Imaging Video Processing Soc Image Sensors Computer Vision Sensors Semiconductors Digital Signal Processors High Dynamic Range Photography Camera Software Development Hdr Architecture Video Compression Imaging Pipeline Architecture and Software Development Computational Imaging R&D Group Management Camera Systems R