Peter R Dutton

US Patent:

20170352966, Dec 7, 2017

Filed:

Jun 6, 2016

Appl. No.:

15/173855

Inventors:

- Berwyn PA, US
Hyo Chang Yun - Saratoga CA, US
Peter J. Dutton - Fremont CA, US

International Classification:

H01R 9/24

Abstract:

An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.

US Patent:

20170226389, Aug 10, 2017

Filed:

Feb 10, 2016

Appl. No.:

15/040993

Inventors:

- Berwyn PA, US
Hyo Chang Yun - Saratoga CA, US
Peter J. Dutton - Fremont CA, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

C09J 127/12
B32B 27/00
B32B 15/00
C09J 7/02
B32B 7/12

Abstract:

An adhesive arrangement includes an adhesive formed from an adhesive composition, the adhesive composition having a fluoropolymeric material, a functionalized fluoropolymeric material, and a thermoplastic material, and a base layer in contact with the adhesive, the base layer being a perfluoropolymeric material, a composite material, a metal material, or a metallic material. The thermoplastic material is selected from the group consisting of polyamide (PA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polyimide (PI), polyimide derivatives such as polyetherimide (PEI), polyaryletherketone (PAEK), polyaryletherketone derivatives, polysulfone, polyethersulfone (PES), polysulfone derivatives, and combinations thereof.

US Patent:

20160268016, Sep 15, 2016

Filed:

Mar 13, 2015

Appl. No.:

14/657998

Inventors:

- Berwyn PA, US
Lei Wang - San Jose CA, US
Peter J. Dutton - Fremont CA, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

H01B 1/24
H01B 13/00
B64G 1/22

Abstract:

Static dissipative articles and processes of producing static dissipative articles are described. The static dissipative article includes a conductor and a dissipative coating over the conductor, the dissipative coating including a polymer matrix and between 0.1 and 10%, by weight, conductive nano-carbons homogenously distributed with the polymer matrix. The dissipative coating has a resistivity of between 10and 10ohmcm, and the conductive-nano-carbons have an aspect ratio of at least 100. The process of producing a coated article includes blending a polymer powder with between 0.1 and 10%, by weight, conductive nano-carbons to form a micron-level homogenous compound, and extruding the compound onto a conductor to form a dissipative coating over the conductor.

US Patent:

20160160090, Jun 9, 2016

Filed:

Dec 4, 2014

Appl. No.:

14/560391

Inventors:

- Berwyn PA, US
Hyo Chang Yun - Saratoga CA, US
Peter J. Dutton - Fremont CA, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

C09J 7/02
B32B 27/32
B32B 15/08
B32B 27/08
B32B 7/12
B32B 15/04

Abstract:

An adhesive arrangement includes an adhesive formed from an adhesive composition having a thermoplastic material and a melt-processable perfluoropolymeric material. The adhesive arrangement further includes a base layer in contact with the adhesive. The thermoplastic material is polyetherimide (PEI), polyphenylenesulfide (PPS), polyaryletherketone (PAEK) including polyetheretherketone (PEEK), polyamide (PA), and/or polysulfone derivatives including polysulfone. The base layer is a perfluoropolymeric material, a composite material, a metal material, a metallic material, another suitable material, or a combination thereof.

US Patent:

20150289388, Oct 8, 2015

Filed:

Apr 4, 2014

Appl. No.:

14/245588

Inventors:

- Berwyn PA, US
Hyo Chang Yun - Saratoga CA, US
Peter J. Dutton - Fremont CA, US
Thomas D. Ratzlaff - Menlo Park CA, US
Paul Craig Tally - Santa Clara CA, US
James O'Keeffe - Newark CA, US
Erling Hansen - Redwood City CA, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

H05K 5/00
H05K 5/03
H05K 5/02

Abstract:

An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit comprises a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.

US Patent:

20150289389, Oct 8, 2015

Filed:

Apr 4, 2014

Appl. No.:

14/245607

Inventors:

- Berwyn PA, US
Hyo Chang Yun - Saratoga CA, US
Peter J. Dutton - Fremont CA, US
Thomas D. Ratzlaff - Menlo Park CA, US
Paul Craig Tally - Santa Clara CA, US
James O'Keeffe - Newark CA, US
Erling Hansen - Redwood City CA, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

H05K 5/00
H05K 5/03
B65D 21/02
H05K 5/02

Abstract:

An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.