Peter R M Fowler

US Patent:

20130134585, May 30, 2013

Filed:

Dec 21, 2012

Appl. No.:

13/725306

Inventors:

IO Semiconductor, Inc. - San Diego CA, US
Stuart B. Molin - Carlsbad CA, US
Mark Drucker - Poway CA, US
Peter Fowler - Poway CA, US

Assignee:

IO SEMICONDUCTOR, INC. - San Diego CA

International Classification:

H01L 23/498
H01L 23/00

US Classification:

257737, 438113

Abstract:

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

US Patent:

20140035129, Feb 6, 2014

Filed:

Dec 21, 2012

Appl. No.:

13/725245

Inventors:

Stuart B. Molin - Carlsbad CA, US
Mark Drucker - Poway CA, US
Peter Fowler - Poway CA, US

Assignee:

IO SEMICONDUCTOR, INC. - San Diego CA

International Classification:

H01L 23/498
H01L 23/00

US Classification:

257737, 438118

Abstract:

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

US Patent:

20160284671, Sep 29, 2016

Filed:

Jun 3, 2016

Appl. No.:

15/173251

Inventors:

- San Diego CA, US
Stuart B. Molin - Carlsbad CA, US
Mark Drucker - Poway CA, US
Peter Fowler - Poway CA, US

International Classification:

H01L 25/065
H01L 27/12
H01L 23/00

Abstract:

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

US Patent:

20150140782, May 21, 2015

Filed:

Dec 16, 2014

Appl. No.:

14/572580

Inventors:

- San Diego CA, US
Stuart B. Molin - Carlsbad CA, US
Mark Drucker - Poway CA, US
Peter Fowler - Poway CA, US

International Classification:

H01L 21/762
H01L 21/84

US Classification:

438458

Abstract:

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

US Patent:

20150108640, Apr 23, 2015

Filed:

Dec 30, 2014

Appl. No.:

14/586668

Inventors:

- San Diego CA, US
Stuart B. Molin - Carlsbad CA, US
Mark Drucker - Poway CA, US
Peter Fowler - Poway CA, US

International Classification:

H01L 23/00

US Classification:

257737

Abstract:

An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.