Philip G Simon

US Patent:

6871544, Mar 29, 2005

Filed:

Mar 16, 2000

Appl. No.:

09/936640

Inventors:

Arjun Selvakumar - Bellaire TX, US
Howard D. Goldberg - Sugar Land TX, US
Duli Yu - Sugar Land TX, US
Matthew Ip - Austin TX, US
Martin A. Schmidt - Reading MA, US
James L. Marsh - San Antonio TX, US
Philip Simon - Houston TX, US

Assignee:

Input/Output, Inc. - Stafford TX

International Classification:

G01P015/00

US Classification:

7351418, 7351423

Abstract:

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

US Patent:

6945110, Sep 20, 2005

Filed:

Jul 21, 2004

Appl. No.:

10/896602

Inventors:

Arjun Selvakumar - Bellaire TX, US
Howard D. Goldberg - Sugar Land TX, US
Duli Yu - Sugar Land TX, US
Matthew Ip - Austin TX, US
Martin A. Schmidt - Reading MA, US
James L. Marsh - San Antonio TX, US
Philip Simon - Houston TX, US

Assignee:

Input/Output, Inc. - Stafford TX

International Classification:

G01P015/00
H01L021/76

US Classification:

7351416, 7351424, 438 15

Abstract:

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

US Patent:

7274079, Sep 25, 2007

Filed:

Aug 22, 2005

Appl. No.:

11/209164

Inventors:

Arjun Selvakumar - Bellaire TX, US
Howard D. Goldberg - Sugar Land TX, US
Duli Yu - Sugar Land TX, US
Matthew Ip - Austin TX, US
Martin A. Schmidt - Reading MA, US
James L. Marsh - San Antonio TX, US
Philip Simon - Houston TX, US

Assignee:

Input/Output, Inc. - Houston TX

International Classification:

H01L 29/84
H01L 21/00

US Classification:

257415, 438 48

Abstract:

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

US Patent:

20020121682, Sep 5, 2002

Filed:

Sep 9, 1999

Appl. No.:

09/392899

Inventors:

RONALD B AZCARATE - BAGUIO CITY, PH
PRIMITIVO A PALASI - BAGUIO CITY, PH
PHILIP B SIMON - HOUSTON TX, US

International Classification:

H01L023/40
H01L023/36
H01L023/495

US Classification:

257/675000, 257/666000

Abstract:

A lead frame that does not tie straps and a die bond pad is rectangular in shape, with the same number of lead frame leads () on opposite sides and a different number of lead frame lead frame leads () on adjacent sides. Lead frame leads () extend into the area in which the tie strap would normally be placed. A heat slug is () taped into the lead frame to provide a semiconductor die mount area. At least one lead () from one side of the lead frame, located where the tie strap is normally located, is connected via a bond wire () to a bond pad () on the semiconductor die () on a side adjacent to the side where the lead frame lead is located.

US Patent:

59491388, Sep 7, 1999

Filed:

Oct 31, 1997

Appl. No.:

8/962159

Inventors:

Primitivo A. Palasi - Baguio, PH
Ronaldo M. Arguelles - Baguio, PH
Philip B. Simon - Houston TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2334
H01L 2310

US Classification:

257712

Abstract:

A heat spreader (10) is provided for dissipating heat from a semiconductor die (32). The heat spreader (10) comprises a thermally conductive sheet (12) having an aperture (14) formed therein. At least one set of opposing members (20) extends inwardly, but do not contact, within the aperture (14). The opposing members (20) can receive adhesive material for securing the semiconductor die (32) to the heat spreader (10) such that the semiconductor die (32) is disposed over the aperture (14).