Ping Jiang

US Patent:

20120015857, Jan 19, 2012

Filed:

Jan 26, 2010

Appl. No.:

13/146438

Inventors:

Tianniu Chen - Rocky Hill CT, US
Steven Bilodeau - Oxford CT, US
Karl E. Boggs - Hopewell Junction NY, US
Ping Jiang - Danbury CT, US
Michael B. Korzenski - Danbury CT, US
George Mirth - Saratoga CA, US
Kim Y. Van Berkel - Mountain View CA, US

Assignee:

ADVANCED TECHNOLOGY MATERIALS, INC. - Danbury CT

International Classification:

C11D 3/60
C11D 3/44
C11D 3/43

US Classification:

510170

Abstract:

Compositions and methods of using said composition for removing polymeric materials from surfaces, preferably cleaning contaminant buildup from a lithography apparatus without total disassembly of said apparatus.

US Patent:

20130295712, Nov 7, 2013

Filed:

May 3, 2012

Appl. No.:

13/463448

Inventors:

Tianniu CHEN - Rocky Hill CT, US
Michael B. KORZENSKI - Danbury CT, US
Ping JIANG - Danbury CT, US
Lawrence H. DUBOIS - Danbury CT, US

Assignee:

ADVANCED TECHNOLOGY MATERIALS, INC. - Danbury CT

International Classification:

H01L 31/18

US Classification:

438 71, 257E31127

Abstract:

Novel methods for the texturing of photovoltaic cells is described, wherein texturing minimizes reflectance losses and hence increases solar cell efficiency. In one aspect, a microstamp with the mirror inverse of the optimum surface structure is described. The photovoltaic cell substrate to be etched and the microstamp are immersed in a bath and pressed together to yield the optimum surface structure. In another aspect, micro and nanoscale structures are introduced to the surface of a photovoltaic cell by wet etching and depositing nanoparticles or introducing metal induced pitting to a substrate surface. In still another aspect, remote plasma source (RPS) or reactive ion etching (RIE), is used to etch nanoscale features into a silicon-containing substrate.