Tianniu Chen - Westford MA, US Michael B. Korzenski - Bethel CT, US Ping Jiang - Danbury CT, US
Assignee:
ADVANCED TECHNOLOGY MATERIALS, INC. - Danbury CT
International Classification:
B23K 1/018 B09B 5/00
US Classification:
228264, 228 19, 228 18
Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.