Rene Martinez

US Patent:

6372999, Apr 16, 2002

Filed:

Apr 20, 1999

Appl. No.:

09/295037

Inventors:

William D. Bjorndahl - Torrance CA
M. David Saferstein - Los Angeles CA
Alexander Krayner - Sherman Oaks CA
Cindy S. Fietze - Redondo Beach CA
Kenneth C. Selk - Hermosa Beach CA
Rene R. Martinez - Lakewood CA
William E. McMullen - Redondo Beach CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01R 1204

US Classification:

174262, 174 522

Abstract:

A multilayer wiring board comprises a substrate having a plurality of layers of reinforced resin material â, a patterned conductive layer â provided on at least one major surface of the substrate, a plurality of via holes provided at least partly through the substrate, and a plurality of signal carrying wires â. The signal carrying wires â are provided between at least two of the layers of reinforced resin material â. The signal carrying wires â can be embedded in a resin layer â, and the resin layer â sandwiched between a pair of the layers of reinforced resin material. The reinforced resin material is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core â, e. g. , a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair of reinforced resin layers sandwiching the signal carrying wires â.

Address:

6038 King Ave APT A, Maywood, CA 90270

VIN:

3GTEC23C09G203767

Make:

GMC

Model:

SIERRA 1500

Year:

2009

Address:

PO Box 909, Los Angeles, CA 90078

VIN:

2C3KA53G17H628798

Make:

CHRYSLER

Model:

300

Year:

2007