Richard J Weber

US Patent:

6735086, May 11, 2004

Filed:

May 13, 2003

Appl. No.:

10/437361

Inventors:

Richard M. Weber - Prosper TX
Kerrin A. Rummel - Richardson TX
Albert P. Payton - Sachse TX

Assignee:

Raytheon Company - Lexington MA

International Classification:

H05K 720

US Classification:

361719, 361704, 361707, 361721, 165 802, 165185

Abstract:

A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially protrude from the slots in the thermal plane. Slot-engaging portions of the feet freely float within the slots, allowing repositioning of the feet in two dimensions relative to the slots. Resilient devices such as springs urge outer portions of the feet into contact with the airframe. Locking mechanisms may prevent extension of the feet until after the heat-conducting device is installed in the missile. The feet self-align into contact with the airframe, automatically adjusting to compensate for misalignment and/or warping.

US Patent:

6952345, Oct 4, 2005

Filed:

Oct 31, 2003

Appl. No.:

10/698953

Inventors:

Richard M. Weber - Prosper TX, US
George F. Barson - Plano TX, US
Michael D. Koehler - Justin TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K007/20

US Classification:

361699, 165 804, 257714, 257715, 361700

Abstract:

An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

US Patent:

6957550, Oct 25, 2005

Filed:

May 19, 2003

Appl. No.:

10/440716

Inventors:

William Gerald Wyatt - Plano TX, US
Richard M. Weber - Prosper TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

F25B043/04
F25B047/00
F23D023/12
F28D015/00

US Classification:

62475, 622592, 62 85, 16510433

Abstract:

A cooling technique involves: reducing a pressure of a cooling fluid to a subambient pressure at which the cooling fluid has a boiling temperature less than a temperature of a heat-generating structure; bringing the cooling fluid at the subambient pressure into thermal communication with the heat-generating structure, so that the coolant absorbs heat, boils and vaporizes; thereafter removing heat from the coolant so as to condense substantially all of the coolant to a liquid; and thereafter extracting a selected portion of the cooling fluid that has been cooled, the selected portion being a vapor that includes a non-condensable gas.

US Patent:

6959753, Nov 1, 2005

Filed:

Jul 1, 1996

Appl. No.:

08/675280

Inventors:

Richard M. Weber - Prosper TX, US
Kerrin A. Rummel - Richardson TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

F28D015/00

US Classification:

16515417, 165185, 16510417, 165901, 165902, 165905, 165907, 165DIG 42

Abstract:

A heat sink which comprises an enclosure having a highly thermally conductive surface region and defining an enclosed cavity. A porous, highly thermally conductive material is disposed in the cavity, preferably homogeneously therein, and is thermally coupled to the thermally conductive surface. A phase change material changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region is preferably aluminum and the porous medium is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity. The highly thermally conductive fibers are preferably graphite and the matrix is preferably an epoxy.

US Patent:

6989991, Jan 24, 2006

Filed:

May 18, 2004

Appl. No.:

10/848336

Inventors:

George F. Barson - Plano TX, US
Richard M. Weber - Prosper TX, US
James L. Haws - McKinney TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 7/20

US Classification:

361699, 361711, 257712, 257714, 174 151, 165 804

Abstract:

According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

US Patent:

7000691, Feb 21, 2006

Filed:

Jul 11, 2002

Appl. No.:

10/192891

Inventors:

Richard M. Weber - Prosper TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

G05D 16/00
F28F 27/00

US Classification:

165281, 165201, 165 60, 165 96, 165911, 62119

Abstract:

An apparatus includes heat-generating structure disposed in an environment having an ambient pressure, and a cooling system for removing heat from the heat-generating structure. The cooling system includes a fluid coolant, structure which reduces a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure; and structure which directs a flow of the liquid coolant at the subambient pressure so that it is brought into thermal communication with the heat-generating structure, the coolant then absorbing heat and changing to a vapor. A method for cooling heat-generating structure disposed in an environment having an ambient pressure includes providing a fluid coolant and reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure. The method also includes bringing the coolant at the subambient pressure into thermal communication with the heat-generating structure, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure.

US Patent:

7092255, Aug 15, 2006

Filed:

Dec 13, 2005

Appl. No.:

11/301567

Inventors:

George F. Barson - Plano TX, US
Richard M. Weber - Prosper TX, US
James L. Haws - McKinney TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 7/20

US Classification:

361699, 361711, 361719, 257714, 174 151, 165 804

Abstract:

According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

US Patent:

7110260, Sep 19, 2006

Filed:

Jun 15, 2005

Appl. No.:

11/154107

Inventors:

Richard M. Weber - Prosper TX, US
George F. Barson - Plano TX, US
Michael D. Koehler - Justin TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 7/20

US Classification:

361700, 361699, 257714, 257715, 174 151, 165 804, 16510421, 16510433

Abstract:

An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.