Robert Lee Singleton

US Patent:

7237724, Jul 3, 2007

Filed:

Apr 6, 2005

Appl. No.:

11/099477

Inventors:

Robert Singleton - Plant City FL, US

International Classification:

G06K 19/06
G06K 19/02
H05K 3/30
H01R 43/00
B29C 45/14

US Classification:

235492, 235488, 29841, 29827, 26427211

Abstract:

A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board, attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.

US Patent:

7607249, Oct 27, 2009

Filed:

Jul 15, 2005

Appl. No.:

11/181814

Inventors:

Robert Singleton - Plant City FL, US

Assignee:

Innovatier Inc. - Lakeland FL

International Classification:

A44C 5/00

US Classification:

40633

Abstract:

A RFID bracelet and a method for manufacturing the same wherein the bracelet is composed of a bottom layer having a top surface and a bottom surface, a radio frequency identification microprocessor attached to the top surface of the bottom layer, an antenna, operably coupled to the radio frequency identification microprocessor and attached to the top surface of the bottom layer, a core layer, positioned above the bottom layer and attached to the bottom layer, the radio frequency identification microprocessor and the antenna and a top layer, positioned above the core layer and attached to the core layer.

US Patent:

20020007552, Jan 24, 2002

Filed:

Aug 24, 2001

Appl. No.:

09/939135

Inventors:

Robert Singleton - Plant City FL, US
Craig Nelson - Melbourne FL, US

International Classification:

H01M010/04
B23P019/10

US Classification:

029/623300, 029/623200, 029/730000

Abstract:

A battery cell manufacturing apparatus comprises a vacuum indexing conveyor for vertically suspending an anode material web, wherein a die punch is used to form a discrete anode from the anode material web. A pick and place mechanism is operable with the die punch for positioning the discrete anode between first and second separator webs for subsequent lamination. A laminator vertically receives the separator webs suspended for longitudinally extending them a force of gravity for smoothing out web surfaces adjacent the discrete anode carried therebetween prior to lamination of the separator webs to the discrete anode. A cathode assembly section includes a vacuum conveyor for guiding cathode material webs and vertically suspending them for die punching discrete cathodes which are then placed onto exposed outside surfaces of the vertically suspended separator webs in alignment with the anode laminated therewith. The discrete cathodes are then laminated to the vertically suspended separator webs for forming a laminated battery cell, which webs are then cut to form a discrete battery cell.

US Patent:

20070290048, Dec 20, 2007

Filed:

Jun 20, 2006

Appl. No.:

11/455936

Inventors:

Robert Singleton - Plant City FL, US
Lawrence J. Keim - Valrico FL, US

International Classification:

G06K 19/06

US Classification:

235492

Abstract:

An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

US Patent:

20080282540, Nov 20, 2008

Filed:

May 14, 2007

Appl. No.:

11/748413

Inventors:

Robert Singleton - Plant City FL, US

International Classification:

H05K 13/00

US Classification:

29856, 29848

Abstract:

Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

US Patent:

53297504, Jul 19, 1994

Filed:

Nov 12, 1992

Appl. No.:

7/975622

Inventors:

Stuart C. Bagley - Dunedin FL
Jon L. McCanless - Brandon FL
Robert W. Singleton - Plant City FL

International Classification:

B65B 728
B65B 4108
B65B 4348
B65B 5122

US Classification:

53559

Abstract:

Apparatus for fabricating blister packs comprising a first support for a web of plastic material located at the input end of the apparatus; a feeder to feed the web of plastic material along a path of travel through the apparatus to the output end thereof; a former means along the path of travel to form wells in a conveyed web of plastic material; dispensers means along the path of travel to dispense pills into the wells; a second support for a web of rupturable material located above the linear path of travel to feed rupturable material onto the plastic material for movement therewith in a two part laminate; a tray for a stack of cards laterally offset from the path of travel; a conveyor to sequentially feed cards from the support means to a location adjacent to the web of plastic material and then into contact therewith; a coupler along the path of travel to couple the plastic material with the cards to form a three part laminate; and a cutter along the linear path of travel to cut the laminate for forming individual blister packs.

US Patent:

20160079573, Mar 17, 2016

Filed:

Nov 23, 2015

Appl. No.:

14/949013

Inventors:

- Lakeland FL, US
Robert W. Singleton - Plant City FL, US
Michael G. Scruggs - Lakeland FL, US
Wade W. Guindy - Henderson NV, US

International Classification:

H01M 2/02
H01M 2/30
H01M 10/42
H01M 2/24

Abstract:

Improved battery packaging and constructions for batteries, particularly thin, flat-profile packaged batteries are provided. The battery packaging constructions may eliminate the need for soldering by providing current collector tabs coated by electrically conductive adhesive tape such as z-axis conductive tape and may provide support for current collector tabs and a regular battery perimeter by providing supportive battery packaging and/or frame materials. Better fabrication results, particularly when the batteries are used in smart cards, RFID tags, and medical devices.

US Patent:

20140307404, Oct 16, 2014

Filed:

May 5, 2014

Appl. No.:

14/270064

Inventors:

Robert Singleton - Plant City FL, US

International Classification:

H05K 1/18
H05K 3/28
H05K 3/06
H05K 1/03
B29C 45/14

US Classification:

361762, 264261, 264157, 216 20

Abstract:

An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.