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Ruying Y Tong

age ~67

from San Diego, CA

Also known as:
  • Ru Ying Tong
  • Ru Y Tong
  • Ru-Ying Te Tong
  • Ru Ying Tongru
  • Ying Tong
  • Rui Y Tong
  • Ying Tong Ru
  • Ying Tong Ruying
  • Tong Ru

Ruying Tong Phones & Addresses

  • San Diego, CA
  • San Jose, CA
  • 1730 Las Joyas Ct, Los Gatos, CA 95032 • (408)8666083
  • Cupertino, CA
  • Campbell, CA

Us Patents

  • Bottom Conductor For Integrated Mram

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  • US Patent:
    7358100, Apr 15, 2008
  • Filed:
    Aug 14, 2007
  • Appl. No.:
    11/891923
  • Inventors:
    Wei Cao - San Jose CA, US
    Cheng Horng - San Jose CA, US
    Ruying Tong - Los Gatos CA, US
    Chen-Jung Chien - Sunnyvale CA, US
    Liubo Hong - San Jose CA, US
  • Assignee:
    Magic Technologies, Inc. - Milpitas CA
  • International Classification:
    H01L 21/00
  • US Classification:
    438 3, 257295, 257E21665
  • Abstract:
    A method to fabricate an MTJ device and its connections to a CMOS integrated circuit is described. The device is built out of three layers. The bottom layer serves as a seed layer for the center layer, which is alpha tantalum, while the third, topmost, layer is selected for its smoothness, its compatibility with the inter-layer dielectric materials, and its ability to protect the underlying tantalum.
  • Bottom Conductor For Integrated Mram

    view source
  • US Patent:
    20070045758, Mar 1, 2007
  • Filed:
    Aug 30, 2005
  • Appl. No.:
    11/215276
  • Inventors:
    Wei Cao - San Jose CA, US
    Cheng Horng - San Jose CA, US
    Ruying Tong - Los Gatos CA, US
    Chen-Jung Chien - Sunnyvale CA, US
    Liubo Hong - San Jose CA, US
  • International Classification:
    H01L 43/00
  • US Classification:
    257421000
  • Abstract:
    A structure that is well suited to connecting an MTJ device to a CMOS integrated circuit is described. It is built out of three layers. The bottom layer serves as a seed layer for the center layer, which is alpha tantalum, while the third, topmost, layer is selected for its smoothness, its compatibility with the inter-layer dielectric materials, and its ability to protect the underlying tantalum. A method for its formation is also described.

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