An apparatus and method for polishing a workpiece including a polishing pad; at least one polishing arm for holding a workpiece to be polished on the polishing pad; at least one conditioning arm for conditioning the polishing pad; and, a slurry dispenser. The slurry dispenser is disposed between the at least one polishing arm and the at least one conditioning arm so that slurry dispensed by the slurry dispenser contacts the at least one conditioning pad before it contacts the at least one polishing pad.
An apparatus and method for polishing a workpiece including a polishing pad, and at least one polishing arm for holding a workpiece to be polished on the polishing pad. The polishing arm includes at least one plastic bearing. The plastic bearing prevents lock up of a vacuum chuck coupled to the polishing arm because it is impervious to slurry which often becomes lodged in conventional ball bearings.