Sanjay K Aggarwal

US Patent:

63236168, Nov 27, 2001

Filed:

May 3, 2000

Appl. No.:

9/564300

Inventors:

Paul Sagues - Ross CA
Robert T. Wiggers - San Francisco CA
Sanjay K. Aggarwal - Berkeley CA
Kevin D. D'Souza - San Francisco CA
Nathan H. Harding - San Francisco CA

Assignee:

Berkeley Process Control, Inc. - Richmond CA

International Classification:

B25J 918

US Classification:

31856811

Abstract:

A wafer handling apparatus having input and output robotic systems directed by a programmed controller. Each system has components including a robot, a twist and rotate, and a carrier and automated carrier rail. The input system is for removing wafers from their wafer pod, placing them in the carrier and transporting them via the rail to a wafer processing area. The output system performs the reverse operation, taking wafers from a carrier following processing and placing them in a pod. Each robot includes a plurality of interconnected, articulated cantilevered arms. The last one of the arms has a wand on one end and a laser emitter detector on the other end, and operates in cooperation with the controller to provide location detection of system components. The controller also includes circuitry for sensing contact of the wand with an object by measuring the increased robot motor torque occurring upon contact. The controller is pre-programmed with approximate physical dimensions of the system components and their relative positions.

US Patent:

63040514, Oct 16, 2001

Filed:

Jun 13, 2000

Appl. No.:

9/592314

Inventors:

Paul Sagues - Ross CA
Robert T. Wiggers - San Francisco CA
Nathan H. Harding - San Francisco CA
Sanjay K. Aggarwal - Berkeley CA

Assignee:

Berkeley Process Control, Inc. - Richmond CA

International Classification:

B25J 918

US Classification:

31856811

Abstract:

Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door. The controller is programmed to direct an automatic calibration of all of the carrier storage locations and the input and output positions.

US Patent:

6075334, Jun 13, 2000

Filed:

Mar 15, 1999

Appl. No.:

9/270261

Inventors:

Paul Sagues - Ross CA
John T. Peurach - San Francisco CA
Sanjay D. Aggarwal - Berkeley CA

Assignee:

Berkeley Process Control, Inc - Richmond CA

International Classification:

B25J 918

US Classification:

31856811

Abstract:

A system for automatically calibrating a semiconductor wafer handling robot so that the robot will move wafers into and out of precise locations within enclosures that form process stations or storage cassettes is disclosed. The system comprises a controller having memory and logic sections connected to a robot having an articulated arm that is movable in vertical (Z), horizontal (. theta. ), and radial (R) directions and having a wafer retaining wand at the end of the arm. Dimensional characteristics of the robot wand and the enclosures are stored in the controller memory. Sensors are provided at each enclosure and/or the robot wand which are activated and provide signals to the controller that are relative to the wand position. The robot is programmed to execute a series of progressive movements at each enclosure location which are controlled by a combination of sensor response signals and the appropriate dimensional characteristics. At the end of the programmed movements, the robot wand is positioned within a process station or cassette so that it can engage for removal or release a wafer therein at a precise predetermined location.