Shane M O'Connor

US Patent:

20200219982, Jul 9, 2020

Filed:

Mar 17, 2020

Appl. No.:

16/821559

Inventors:

- Waltham MA, US
Mark Rosker - Waltham MA, US
Thomas E. Kazior - Waltham MA, US
Shane A. O'Connor - Waltham MA, US
Emily Elswick - Waltham MA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

H01L 29/20
H01L 23/482
H01L 23/29
H01L 23/552
H01L 23/538

Abstract:

A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

US Patent:

20190165108, May 30, 2019

Filed:

Nov 30, 2017

Appl. No.:

15/827349

Inventors:

- Waltham MA, US
Mark Rosker - Waltham MA, US
Thomas E. Kazior - Waltham MA, US
Shane A. O'Connor - Waltham MA, US
Emily Elswick - Waltham MA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

H01L 29/20
H01L 23/482
H01L 23/538
H01L 23/552
H01L 23/29

Abstract:

A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is hermetically sealed in a space defined by the respective aperture and the second substrate. One or more vias are provided to access I/O signals at a surface of the first or second substrates. The modules may include an invariant die where different technologies are stacked together.