Thomas D Chen

US Patent:

D559232, Jan 8, 2008

Filed:

Dec 15, 2006

Appl. No.:

29/275152

Inventors:

Wen Ku - Cupertino CA, US
Sally Li - Los Altos CA, US
Thomas Chen - Foster City CA, US
Yi-Wen Chen - Taipei, TW

Assignee:

Fortemedia, Inc. - Cupertino CA
MVOX Technologies, Inc. - Cupertino CA

International Classification:

1401

US Classification:

D14223

US Patent:

7718457, May 18, 2010

Filed:

Apr 5, 2005

Appl. No.:

11/099118

Inventors:

Thomas Chen - Cambridge MA, US
Michael Judy - Wakefield MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/00

US Classification:

438 52, 257419, 257E2131, 216 2

Abstract:

A method of producing a MEMS device provides an apparatus having structure on a first layer that is proximate to a substrate. The apparatus has a space proximate to the structure. The method adds doped material to the space. The doped material dopes at least a portion of the first layer.

US Patent:

8103027, Jan 24, 2012

Filed:

Mar 26, 2009

Appl. No.:

12/411768

Inventors:

Xin Zhang - Acton MA, US
Thomas Chen - Cambridge MA, US
Sushil Bharatan - Arlington MA, US
Aleksey S. Khenkin - Peterborough NH, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H04R 25/00

US Classification:

381175, 381191

Abstract:

A MEMS microphone has an SOI wafer, a backplate formed in a portion of the SOI wafer, and a diaphragm adjacent to and movable relative to the backplate. The backplate has at least one trench that substantially circumscribes a central portion of the backplate.

US Patent:

8389314, Mar 5, 2013

Filed:

Oct 3, 2006

Appl. No.:

11/538281

Inventors:

John R. Martin - Foxborough MA, US
Thomas D. Chen - Cambridge MA, US
Jinbo Kuang - Acton MA, US
Thomas Kieran Nunan - Carlisle MA, US
Xin Zhang - Acton MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/00

US Classification:

438 48, 438691, 257414, 257415, 257E21499, 257E31117

Abstract:

A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced from the first layer, and an insulator layer between the first layer and second layer. The first layer has a top surface, while the second layer has a bottom surface facing the top surface. After providing the MEMS apparatus, the method increases the roughness of at least the top surface of the first layer or the bottom surface of the second layer.

US Patent:

8455288, Jun 4, 2013

Filed:

Sep 14, 2011

Appl. No.:

13/232282

Inventors:

Kuang L. Yang - Newton MA, US
Thomas D. Chen - Cambridge MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/00

US Classification:

438 53, 216 2

Abstract:

A micromachining process forms a plurality of layers on a wafer. This plurality of layers includes both a support layer and a given layer. The process also forms a mask, with a mask hole, at least in part on the support layer. In this configuration, the support layer is positioned between the mask hole and the given layer, and longitudinally spaces the mask hole from the given layer. The process also etches a feature into the given layer through the mask hole.

US Patent:

8590136, Nov 26, 2013

Filed:

Aug 27, 2010

Appl. No.:

12/870288

Inventors:

Kuang L. Yang - Newton MA, US
Li Chen - Arlington MA, US
Thomas D. Chen - Cambridge MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H04R 31/00

US Classification:

29594, 29 2541, 295921, 296091, 257704, 257723, 257724, 257729, 381113, 381116, 381171, 381181, 381182, 438 47, 438142

Abstract:

A dual backplate MEMS microphone system including a flexible diaphragm sandwiched between two single-crystal silicon backplates may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm.

US Patent:

8208671, Jun 26, 2012

Filed:

Jan 16, 2009

Appl. No.:

12/355432

Inventors:

Thomas Chen - Cambridge MA, US
Michael Judy - Ipswich MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H04R 19/04
G01L 9/00

US Classification:

381360, 257419

Abstract:

A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least one rib protruding inward toward a center of the backside cavity.

US Patent:

20040104444, Jun 3, 2004

Filed:

Dec 3, 2002

Appl. No.:

10/308688

Inventors:

Bruce Wachtmann - Concord MA, US
David Collins - Pelham NH, US
Thomas Chen - Malden MA, US

International Classification:

H01L027/14

US Classification:

257/414000

Abstract:

A MEMS device has a first silicon layer, a second silicon layer, and an insulating layer between the first and second silicon layers. The first silicon layer has at least a primary portion and an isolated portion, where the isolated portion has no electrical connection with the primary portion via the first silicon layer. The MEMS device also has a conductive element within the insulating layer. The conductive element is in electrical contact with both the primary portion and the isolated portion.