Thomas E Morris

US Patent:

8415567, Apr 9, 2013

Filed:

Feb 4, 2010

Appl. No.:

12/700512

Inventors:

Brian D. Sawyer - Palo Alto CA, US
Thomas Scott Morris - Lewisville NC, US
Milind Shah - San Diego CA, US

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H05K 1/16
H05K 3/34

US Classification:

174260, 29840

Abstract:

The present invention relates to a multi-layer laminate or substrate manufacturing process for forming soldering surfaces on a substrate of a module without requiring a solder mask. In one embodiment, a substrate is provided having a substrate body, soldering pads, and a metal segment. A patterned mask is formed over the substrate such that soldering surfaces of the soldering pads remain exposed. The soldering surfaces of the soldering pads are plated to create plated soldering surfaces over the soldering pads. The plated soldering surfaces are the regions for solder placement. The patterned mask is then removed from the substrate. Next, an anti-wetting treatment is applied to the substrate such that any unplated metal surfaces react to the anti-wetting treatment to form treated surfaces. As such, the plated soldering surfaces will wet solder while the treated surface will not wet solder. In a preferred embodiment, the anti-wetting treatment is an oxidation process.

US Patent:

20150124421, May 7, 2015

Filed:

Jan 13, 2015

Appl. No.:

14/595401

Inventors:

- Greensboro NC, US
Brian D. Sawyer - Menlo Park CA, US
Stephen Parker - Burlington NC, US
Thomas Scott Morris - Lewisville NC, US

International Classification:

H05K 1/02
H05K 1/11
H05K 1/18

US Classification:

361767

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.