Thomas E Morris

US Patent:

8434220, May 7, 2013

Filed:

Dec 7, 2007

Appl. No.:

11/952617

Inventors:

Jayanti Jaganatha Rao - Jamestown NC, US
Thomas Scott Morris - Clemmons NC, US
Milind Shah - Greensboro NC, US

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H05K 3/20
H05K 3/30
H05K 3/34

US Classification:

29832, 29831, 29841

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

US Patent:

20120193781, Aug 2, 2012

Filed:

Dec 6, 2011

Appl. No.:

13/311687

Inventors:

Julio Costa - Oak Ridge NC, US
Jonathan Hale Hammond - Oak Ridge NC, US
Thomas Scott Morris - Lewisville NC, US

Assignee:

RF MICRO DEVICES, INC. - Greensboro NC

International Classification:

H01L 23/48
H01L 23/498
H01L 21/768

US Classification:

257737, 438637, 438613, 257773, 257E21575, 257E23011, 257E23068

Abstract:

Disclosed is a method for fabricating a customized micro-electromechanical systems (MEMS) integrated circuit using at least one redistribution layer. The method includes steps of providing a substrate on which MEMS components are fabricated and coupling predetermined ones of the MEMS components via the redistribution traces.

US Patent:

20120217048, Aug 30, 2012

Filed:

Feb 25, 2011

Appl. No.:

13/034755

Inventors:

Donald Joseph Leahy - Kernersville NC, US
Brian D. Sawyer - Menlo Park CA, US
Stephen Parker - Burlington NC, US
Thomas Scott Morris - Lewisville NC, US

Assignee:

RF MICRO DEVICES, INC. - Greensboro NC

International Classification:

H05K 1/02
H05K 3/30

US Classification:

174258, 29832

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

US Patent:

20200111708, Apr 9, 2020

Filed:

Jun 24, 2019

Appl. No.:

16/449885

Inventors:

- Greensboro NC, US
Rommel Quintero - High Point NC, US
Thomas Scott Morris - Lewisville NC, US

International Classification:

H01L 21/78
H01L 21/683
H01L 21/56
H01L 23/00
H01L 23/498

Abstract:

A process for molding a back side wafer singulation guide is disclosed. Structures for heat mitigation include an overmold formed over a contact surface of a device layer of a wafer, covering bump structures. The overmold and bump structures are thinned and planarized, and the overmold provides an underfill to increase interconnect reliability of a semiconductor die in a flip chip bonded package. However, visibility of singulation guides on the contact surface is obstructed. A channel is formed extending through the device layer and into the handle layer, and is filled with the overmold. The handle layer is replaced with a thermally-conductive molding layer formed on the back side for dissipating heat generated by semiconductor devices. The thermally-conductive handle is thinned until the overmold in the channel beneath the device layer is exposed. The exposed overmold provides a visible back side singulation guide for singulating the wafer.

US Patent:

20140146489, May 29, 2014

Filed:

May 10, 2013

Appl. No.:

13/891809

Inventors:

- Greensboro NC, US
Donald Joseph Leahy - Kernersville NC, US
Thomas Scott Morris - Lewisville NC, US
David C. Dening - Stokesdale NC, US
David Jandzinski - Summerfield NC, US

International Classification:

H05K 1/02
H05K 3/38

US Classification:

361748, 174257, 427125

Abstract:

An electronic substrate includes a non-conductive body and one or more conductive features coupled to the non-conductive body. Each of the conductive features includes a base layer. To preserve the performance and conductivity of the one or more conductive features, each of the conductive features includes a protective layer formed over the base layer. The protective layer may include a first layer of silver formed over the base layer and a second layer of palladium formed over the first layer. By depositing the protective layer over the base layer of each of the conductive features, oxidation and exposure of the conductive features is prevented, or at least substantially reduced, since the first layer and the second layer provide a migration barrier for the metal in the base layer. However, the performance and conductivity of the conductive features are maintained due to the low resistivity of silver and palladium.