Tong G Chen

US Patent:

6498532, Dec 24, 2002

Filed:

Jan 12, 2001

Appl. No.:

09/759736

Inventors:

Yehuda G. Goren - Palo Alto CA
Charles E. Jensen - Carmichael CA
Donald R. Gagne - Placerville CA
Tong Chen - Mountain View CA
Philip M. Lally - Palo Alto CA

Assignee:

Teledyne Technologies Incorporated - Los Angeles CA

International Classification:

H03F 358

US Classification:

330 43, 330149, 315 393

Abstract:

An amplifier system. The amplifier system includes a vacuum tube amplifier, an electron source voltage modulation circuit, and a linearization circuit. The vacuum tube amplifier includes an input signal terminal and an output signal terminal. The electron source voltage modulation circuit includes an input terminal coupled to one of the input signal terminal and the output signal of the vacuum tube amplifier, and includes an output terminal coupled to one of an electron source of the vacuum tube amplifier and an interaction region of the vacuum tube amplifier. The linearization circuit is coupled to the input signal terminal of the vacuum tube amplifier. In conjunction with or instead of the electron source voltage modulation circuit, the amplifier circuit may additionally include an electron beam control circuit, including an input terminal coupled to one of the input signal terminal and the output signal of the vacuum tube amplifier, and including an output terminal coupled to the electron source of the vacuum tube amplifier.

US Patent:

6507110, Jan 14, 2003

Filed:

Mar 8, 2000

Appl. No.:

09/521374

Inventors:

Tong Chen - Mountain View CA
Suchet P. Chai - San Jose CA

Assignee:

Teledyne Technologies Incorporated - Los Angeles CA

International Classification:

H01L 2334

US Classification:

257728, 257275, 257259

Abstract:

A microwave device, including a substrate having a first surface and a second surface, a plurality of electrically conductive vias extending through the substrate from the first surface to the second surface, a first interconnect trace connected to the first surface of the substrate and electrically connected to a first of the plurality of vias, a second interconnect trace connected to the first surface of the substrate and electrically connected to a second of the plurality of vias, and a microwave circuit chip connected to the second surface of the substrate and electrically connected to the first and second conductive vias.

US Patent:

6590450, Jul 8, 2003

Filed:

Aug 31, 2001

Appl. No.:

09/943861

Inventors:

Tong Chen - Mountain View CA
Yehuda G. Goren - Palo Alto CA

Assignee:

Teledyne Technologies Incorporated - Los Angeles CA

International Classification:

H03F 126

US Classification:

330149, 330 3, 330129, 330 43

Abstract:

An amplifier system including a vacuum tube amplifier having an input signal terminal, an output signal terminal, and an electron source, and a control circuit having an input terminal coupled to one of the input signal terminal and the output signal terminal, and for controlling a kinetic energy of electrons emitted by the electron source based on one of an input signal to the vacuum tube amplifier and an output signal from the vacuum tube amplifier. According to another embodiment, the control circuit may be for controlling an amount of electrons emitted by the electron source based on one of the input signal to the vacuum tube amplifier and the output signal from the vacuum tube amplifier. According to another embodiment, the control circuit may be for both controlling the kinetic energy of electrons emitted by the electron source based on one of the input signal and the output signal, and controlling the amount of electrons emitted by the electron source based on one of the input signal and the output signal.

US Patent:

6828663, Dec 7, 2004

Filed:

Mar 7, 2001

Appl. No.:

09/801339

Inventors:

Tong Chen - Mountain View CA
Suchet P. Chai - San Jose CA

Assignee:

Teledyne Technologies Incorporated - Los Angeles CA

International Classification:

H01L 2302

US Classification:

257678, 257666, 257684, 257704, 438106, 438121, 438125

Abstract:

A method of packaging a device and an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes an injection molded plastic body and at least one electrically conductive lead. The body of the cover is connected to the base such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is electrically connected to the device.

US Patent:

6933603, Aug 23, 2005

Filed:

Jul 11, 2002

Appl. No.:

10/192906

Inventors:

Tong Chen - Mountain View CA, US

Assignee:

Teledyne Technologies Incorporated - Los Angeles CA

International Classification:

H01L023/34

US Classification:

257713, 257712, 257706, 257778, 361736, 361711

Abstract:

A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and the second substrate. The device also includes a circuit chip connected to the transmission line.

US Patent:

20050023663, Feb 3, 2005

Filed:

Aug 30, 2004

Appl. No.:

10/930026

Inventors:

Tong Chen - Mountain View CA, US
Suchet Chai - San Jose CA, US

International Classification:

H05K001/00
H01R012/00
H01L021/44
H01L023/02

US Classification:

257678000, 438106000

Abstract:

A method of forming a package. The method includes attaching a device to a baseplate to form a subassembly, and placing the subassembly into an opening defined by a cover that includes a plastic body and a lead such that the device is connected to the lead. The method further includes sealing a gap between the cover and the baseplate.

US Patent:

20120320448, Dec 20, 2012

Filed:

Jun 15, 2012

Appl. No.:

13/525189

Inventors:

Jiang LI - Pasadena CA, US
Tong CHEN - Pasadena CA, US
Kerry VAHALA - Pasadena CA, US

International Classification:

G02F 2/02
C03C 25/68
C03C 25/22

US Classification:

359332, 65414

Abstract:

A frequency comb generator fabricated on a chip with elimination of a disadvantageous reflow process, includes an ultra-high Q disk resonator having a waveguide that is a part of a wedge structure fabricated from a silicon dioxide layer of the chip. The disk resonator allows generation of a frequency comb with a mode spacing as low as 2.6 GHz and up to 220 GHz. A surface-loss-limited behavior of the disk resonator decouples a strong dependence of pumping threshold on repetition rate.

US Patent:

20120321245, Dec 20, 2012

Filed:

Jun 12, 2012

Appl. No.:

13/494707

Inventors:

Kerry VAHALA - PASADENA CA, US
Tong CHEN - PASADENA CA, US
Jiang LI - PASADENA CA, US

International Classification:

G02B 6/125
G02B 6/136
H01L 21/02
G02B 6/10

US Classification:

385 14, 385130, 438 31, 257E21002

Abstract:

A method of manufacturing a waveguide eliminates a prior art reflow step and introduces certain new steps that permit fabricating of an ultra-low loss waveguide element on a silicon chip. The ultra-low loss waveguide element may be adapted to fabricate a number of devices, including a wedge resonator and a ultra-low loss optical delay line having an extended waveguide length.