Trang N Trinh

US Patent:

6377464, Apr 23, 2002

Filed:

Jan 29, 1999

Appl. No.:

09/239617

Inventors:

Hassan Hashemi - Laguna Niguel CA
Shiaw Chang - Thousand Oaks CA
Roger Forse - Santa Barbara CA
Evan McCarthy - Costa Mesa CA
Trang Trinh - Cypress CA
Thuy Tran - El Monte CA

Assignee:

Conexant Systems, Inc. - Newport Beach CA

International Classification:

H05K 702

US Classification:

361760, 361761, 361762, 361763, 361764, 361766, 361777, 361782, 361715, 257713, 257516

Abstract:

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

US Patent:

6466770, Oct 15, 2002

Filed:

Aug 31, 1999

Appl. No.:

09/386863

Inventors:

Scott A. Griffith - San Clemente CA
Trang N. Trinh - Cypress CA

Assignee:

Skyworks Solutions, Inc. - Newport Beach CA

International Classification:

H04B 102

US Classification:

455 91, 455326, 455323, 333 25, 343859

Abstract:

A BALUN circuit comprising a lead network coupled to the positive phase output of a differential power amplifier, a negative phase output coupled to the negative phase output of the differential amplifier, and a delay element coupled in series with the lag network. The output of the lead network and the delay element are combined to form a single-ended output. The lag and lead networks may adjust the output impedances of the positive and negative phase outputs so that the output impedance of the single-ended output is set to a desired value. In one implementation, selected components of the lag and lead networks, and the delay element, comprise printed elements.

US Patent:

6680653, Jan 20, 2004

Filed:

Dec 20, 2000

Appl. No.:

09/742256

Inventors:

Scott A. Griffith - San Clemente CA
Trang N. Trinh - Cypress CA
Pete Good - Dana Point CA

Assignee:

Skyworks Solutions, Inc. - Newport Beach CA

International Classification:

H03L 700

US Classification:

331 17, 331 1 A, 327156, 327157, 327159, 375326, 455260

Abstract:

A system provided for controlling an output frequency of a voltage controlled oscillator relative to a reference frequency. A method includes the steps of detecting a phase error between a divided output of the voltage controlled oscillator and the reference frequency, pumping a frequency control input of the voltage controlled oscillator with the phase error and adjusting a pumping gain based upon a magnitude of the frequency control input to the voltage controlled oscillator. This apparatus includes a phase detector adapted to detect the phase error between the divided output of the voltage controlled oscilator and the reference frequency and a charge pump adapted to pump the frequency control input of the voltage controlled oscillator with the phase error. The apparatus also includes a gain controller adapted to adjust the pumping gain based upon the magnitude of the frequency control input to the voltage controlled oscillator.

US Patent:

6770955, Aug 3, 2004

Filed:

Dec 15, 2001

Appl. No.:

10/020105

Inventors:

Roberto Coccioli - Simi Valley CA
Mohamed A. Megahed - San Diego CA
Trang N. Trinh - Cypress CA
Larry D. Vittorini - Irvine CA
John S. Walley - Ladera Ranch CA

Assignee:

Skyworks Solutions, Inc. - Irvine CA

International Classification:

H01L 23552

US Classification:

257659, 257660, 257728, 257774, 257738, 257780, 257784, 257787, 343700 MS

Abstract:

One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

US Patent:

6818985, Nov 16, 2004

Filed:

Dec 22, 2001

Appl. No.:

10/026134

Inventors:

Roberto Coccioli - Simi Valley CA
Mohamed A. Megahed - San Diego CA
Trang N. Trinh - Cypress CA
Larry D. Vittorini - Irvine CA
John S. Walley - Ladera Ranch CA

Assignee:

Skyworks Solutions, Inc. - Irvine CA

International Classification:

H05K 720

US Classification:

257728, 257421, 257702, 257724, 257725, 257668, 257700, 257701, 257685, 257528, 257240, 257737, 257738, 257734, 257723, 343700 MS, 343767, 361720

Abstract:

According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

US Patent:

6885561, Apr 26, 2005

Filed:

Oct 30, 2001

Appl. No.:

10/020380

Inventors:

Hassan Hashemi - Laguna Niguel CA, US
Shiaw Chang - Thousand Oaks CA, US
Roger Forse - Santa Barbara CA, US
Evan McCarthy - Costa Mesa CA, US
Trang Trinh - Cypress CA, US
Thuy Tran - El Monte CA, US

Assignee:

Skyworks Solutions, Inc. - Irvine CA

International Classification:

H05K007/02
H05K007/06
H05K007/08
H05K007/10

US Classification:

361760, 361761, 361763, 361803, 361816, 361818, 174 35 R, 174260, 174261

Abstract:

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

US Patent:

52652661, Nov 23, 1993

Filed:

Apr 2, 1991

Appl. No.:

7/679400

Inventors:

Trang N. Trinh - Cypress CA

Assignee:

Rockwell International Corporation - Seal Beach CA

International Classification:

H04B 126

US Classification:

455326

Abstract:

A passive uniplanar double-balanced star RF mixer, comprising a substantially planar support substrate with a conductive layer of material disposed on one side and a slotline and first, second, and third coplanar waveguides formed therein which are configured to accommodate different frequencies. The first waveguide is bifurcated on one end into two waveguide branches which form first and second waveguide terminations each physically coupled to one end of the slotline. The second waveguide is electrically coupled to the first waveguide at a location spaced apart from the branches. The third waveguide is electrically coupled to the slotline at a position located approximately equi-distant from the slotline ends. A first grounding element is connected to the grounds of the first and third waveguides, and is positioned adjacent to the first branch termination. A conductive surface is enclosed by the waveguide branches and the slotline.

US Patent:

51251116, Jun 23, 1992

Filed:

Sep 4, 1990

Appl. No.:

7/576755

Inventors:

Trang N. Trinh - Cypress CA

Assignee:

Rockwell International Corporation - Seal Beach CA

International Classification:

H04B 126
H01P 510

US Classification:

455327

Abstract:

A passive uniplanar double-balanced RF mixing apparatus, comprising a planar support substrate with first and second conductive layers disposed on first and second sides, and first and second linear slotlines having open terminations on a first end thereof formed in the first conductive layer. First and second coplanar waveguides are also formed in the first conductive layer with each having one end electrically coupled to first and of said first and second slotlines, respectively. A first balun comprises the first coplanar waveguide connection to the first slotline, and a second balun comprises the second coplanar waveguide connection the second slotline. An isolation gap formed in the first conductive layer adjacent to and between the first and second slotlines provided electrical isolation between the first and second baluns and waveguides for RF-toLO isolation. A transfer element, in the form of a third coplanar waveguide or a conductive via, is electrically connected to one of the baluns adjacent to, but removed a predetermined distance from, the associated slotline for transferring intermediate oscillator frequency signals. A folded diode ring is connected between the slotlines and to the first and second baluns.