Wayne G Austin

US Patent:

40041956, Jan 18, 1977

Filed:

May 12, 1975

Appl. No.:

5/576607

Inventors:

George Michael Harayda - Middlesex NJ
Wayne Miller Austin - Flemington NJ

Assignee:

RCA Corporation - New York NY

International Classification:

H01L 2340

US Classification:

317100

Abstract:

A heat-sink assembly adapted for use with a high-power stud-mounted semiconductor device comprises a heat-dispersing arm having one end securely attached to a circuit board and the other end shaped for semipermanent connection and thermal coupling to a heat-conductive stud. The arm is sufficiently bendable to allow displacement thereof from above the surface of the device mounted on the circuit board for removal of the device from the circuit board after disconnecting the other end from the stud while keeping the one end securely attached to the circuit board. The heat-sink assembly may further comprise means for semipermanently connecting the other end of the arm to the stud and retaining the other end in intimate thermal contact therewith.