Wen Jeng Lin

US Patent:

7069101, Jun 27, 2006

Filed:

Jul 29, 1999

Appl. No.:

09/363966

Inventors:

John F. Arackaparambil - San Carlos CA, US
Tom Chi - San Jose CA, US
Billy Chow - Menlo Park CA, US
Patrick M. D'Souza - Mountain View CA, US
Parris Hawkins - Pleasanton CA, US
Charles Huang - Union City CA, US
Jett Jensen - Campbell CA, US
Badri N. Krishnamurthy - Mountain View CA, US
Pradeep M. Kulkarni - Sunnyvale CA, US
Prakash M. Kulkarni - Sunnyvale CA, US
Wen Fong Lin - San Jose CA, US
Shantha Mohan - Palo Alto CA, US
Bishnu Nandy - Union City CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G06F 19/00

US Classification:

700121, 700 96, 700115

Abstract:

The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle () having lifecycle activities for SW developing and integrating (), installing and administrating (), factory modeling (), manufacturing planning (), manufacturing controlling, monitoring and tracking () and analyzing of manufacturing results (). The factory lifecycle comprises framework components. The distributed factory system framework also includes application components and software building blocks. The framework components are adapted for managing the application components, while the application components are utilized to provide instructions for managing a process such as a wafer fab. The building blocks are adapted for forming or modifying framework and application components. The distributed factory system framework provides computer implemented methods for integrating processing systems and facilitates process and equipment changes.

US Patent:

7174230, Feb 6, 2007

Filed:

Feb 28, 2002

Appl. No.:

10/084092

Inventors:

John F. Arackaparambil - San Carlos CA, US
Tom Chi - San Jose CA, US
Billy Chow - Menlo Park CA, US
Patrick M. D'Souza - Mountain View CA, US
Parris Hawkins - Pleasanton CA, US
Charles Huang - Union City CA, US
Jett Jensen - Campbell CA, US
Badri N. Krishnamurthy - Mountain View CA, US
Pradeep M. Kulkarni - Sunnyvale CA, US
Prakash M. Kulkarni - Sunnyvale CA, US
Wen Fong Lin - San Jose CA, US
Shantha Mohan - Palo Alto CA, US
Bishnu Nandy - Union City CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G06F 19/00

US Classification:

700 96, 700121

Abstract:

The present invention provides a novel distributed factory system framework including a novel factory automation lifecycle () having lifecycle activities for SW developing and integrating (), installing and administrating (), factory modeling (), manufacturing planning (), manufacturing controlling, monitoring and tracking () and analyzing of manufacturing results (). The factory lifecycle comprises framework components. The distributed factory system framework also includes application components and building blocks. The framework components are adapted to for managing the application components, while the application components are utilized to provide instructions for managing a process such as a wafer fab. The building blocks are adapted for forming or modifying framework and application components. The distributed factory system framework provides computer implemented methods for integrating processing systems and facilitates process and equipment changes.

US Patent:

20130258181, Oct 3, 2013

Filed:

Mar 30, 2012

Appl. No.:

13/435596

Inventors:

Kevin Ka Kei Leung - Milpitas CA, US
Wen Hua Lin - Fremont CA, US

Assignee:

OMNIVISION TECHNOLOGIES, INC. - Santa Clara CA

International Classification:

H04N 5/225
B23P 17/04

US Classification:

348374, 29428, 348E05026

Abstract:

An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. The protective tube includes an outer wall having a snap-in latch element disposed thereon. A metal housing encloses the protective tube. The metal housing includes a housing foot and inner wall having an opposite snap-in latch element disposed thereon. The image sensor module is adapted to be secured between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube.

US Patent:

20200007422, Jan 2, 2020

Filed:

Jun 29, 2018

Appl. No.:

16/024381

Inventors:

- Sunnyvale CA, US
Selvakumar SIVARAJ - Sunnyvale CA, US
Wen LIN - Andover MA, US

International Classification:

H04L 12/26
H04L 12/46
H04L 12/721
H04L 12/24

Abstract:

A network device may generate a route advertisement that includes a media access control (MAC) address. The MAC address may correspond to a data link established between the network device and a customer edge (CE) device. The network device and the CE device may be associated with an Ethernet virtual private network (EVPN) that includes other network devices that are remote from the CE device. The network device may cause the route advertisement to be outputted over the EVPN. The route advertisement may permit the other network devices to learn that the data link is directly reachable via the MAC address, and may permit the other network devices, when configured as maintenance endpoints (MEPs), to directly address performance monitoring-related unicast packets, intended for the data link, using the MAC address, such that flooding of the performance monitoring-related unicast packets is avoided.

US Patent:

20180287990, Oct 4, 2018

Filed:

Jun 4, 2018

Appl. No.:

15/997214

Inventors:

- Sunnyvale CA, US
Nitin Singh - Fremont CA, US
Wen Lin - Andover MA, US
Hassan C. Hosseini - San Jose CA, US

International Classification:

H04L 29/12
H04L 12/46
H04L 12/721
H04L 12/751
H04L 12/723
H04L 12/66

Abstract:

A network device is configured to provide, via an Ethernet segment with a customer network, active-active multi-homing L2 virtual bridge connectivity to the customer network using an EVPN instance (EVI) and L3 routing using an IRB interface that is a L3 routing interface assigned to the EVI; to receive, from a peer PE device of the EVPN instance, an EVPN route comprising an L2-L3 binding for a customer device of the customer network and associating the L2-L3 binding with the Ethernet segment, the L2-L3 binding comprising an L2 and an L3 address assigned to the customer device, wherein the peer PE device provides, with the network device and via the Ethernet segment, active-active multi-homing L2 virtual bridge connectivity to the customer network; and to forward, via the Ethernet segment and based at least on the L2-L3 binding received from the peer PE device, an L3 packet to the customer device.

US Patent:

20180006995, Jan 4, 2018

Filed:

Jun 30, 2016

Appl. No.:

15/198948

Inventors:

- Sunnyvale CA, US
Nitin Singh - Fremont CA, US
Wen Lin - Andover MA, US
Hassan C. Hosseini - San Jose CA, US

International Classification:

H04L 29/12
H04L 12/46
H04L 12/721
H04L 12/751
H04L 12/723
H04L 12/66

Abstract:

A network device is configured to provide, via an Ethernet segment with a customer network, active-active multi-homing L2 virtual bridge connectivity to the customer network using an EVPN instance (EVI) and L3 routing using an IRB interface that is a L3 routing interface assigned to the EVI; to receive, from a peer PE device of the EVPN instance, an EVPN route comprising an L2-L3 binding for a customer device of the customer network and associating the L2-L3 binding with the Ethernet segment, the L2-L3 binding comprising an L2 and an L3 address assigned to the customer device, wherein the peer PE device provides, with the network device and via the Ethernet segment, active-active multi-homing L2 virtual bridge connectivity to the customer network; and to forward, via the Ethernet segment and based at least on the L2-L3 binding received from the peer PE device, an L3 packet to the customer device.

US Patent:

20150070466, Mar 12, 2015

Filed:

Sep 9, 2013

Appl. No.:

14/022028

Inventors:

- Santa Clara CA, US
Wen Hua Lin - Fremont CA, US

Assignee:

OmniVision Technologies, Inc. - Santa Clara CA

International Classification:

H04N 13/02
H04N 5/369
H04N 9/04

US Classification:

348 46

Abstract:

A camera device includes a single imaging sensor, a plurality of imaging objectives associated with the single imaging sensor, and a plurality of dedicated image areas within the single imaging sensor, each of the plurality of dedicated image areas corresponding to a respective one of the plurality of imaging objectives, such that images formed by each of the plurality of imaging objectives may be recorded by the single imaging sensor.