Robert W. Berner - Kalispell MT Daniel J. Woodruff - Kalispell MT Wayne J. Schmidt - Kalispell MT Kevin W. Coyle - Kalispell MT Vladimir Zila - Carbough, CA Worm Lund - Bellevue WA
Assignee:
Semitool, Inc. - Kalispell MT
International Classification:
H01L 2100
US Classification:
29 2501, 414941
Abstract:
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.
Robert W. Berner - Kalispell MT, US Daniel J. Woodruff - Kalispell MT, US Wayne J. Schmidt - Kalispell MT, US Kevin W. Coyle - Kalispell MT, US Vladimir Zila - Carbough, CA Worm Lund - Bellevue WA, US
Assignee:
Semitool, Inc. - Kalispell MT
International Classification:
H01L 21/00 H01L 21/64
US Classification:
29 2501
Abstract:
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
Method And Apparatus For Contouring Composite Pre-Preg Articles
Paul E. Nelson - University Place WA, US Peter D. McCowin - Enumclaw WA, US Worm Lund - Bellevue WA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
B32B 37/10
US Classification:
156220, 156285, 264544, 264552, 264553, 264571
Abstract:
A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.
Robert Berner - Kalispell MT, US Daniel Woodruff - Kalispell MT, US Wayne Schmidt - Kalispell MT, US Kevin Coyle - Kalispell MT, US Vladimir Zila - Carbough, CA Worm Lund - Bellevue WA, US
International Classification:
B21F041/00
US Classification:
029025000
Abstract:
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
Method And Apparatus For Contouring Composite Pre-Preg Articles
Paul E. Nelson - University Place WA, US Peter D. McCowin - Enumclaw WA, US Worm Lund - Bellevue WA, US
Assignee:
THE BOEING COMPANY - Chicago IL
International Classification:
B32B 37/10 B32B 37/02
US Classification:
156221, 156580
Abstract:
A forming tool and method for its use with flat pre-preg composite laminate assemblies which incorporates a mandrel segmented into multiple forming blocks, the forming blocks sized to receive a draped composite laminate assembly with all portions of the composite laminate assembly spaced from a shaping surface on each block. A spline plate engages the shaping surface of the forming blocks to provide a neutral axis for maintaining the entire composite laminate assembly in tension during forming. In the exemplary embodiments, the draped composite laminate assembly is formed to the forming blocks from the flat composite laminate assembly and maintained in contact with the forming blocks using a vacuum bag. The mandrel forming blocks are then displaced to a desired curvature on the spline plate.
Vertical Thermal Processor For Semiconductor Wafers
Donald W. Heidt - Whitewright TX Steve Thompson - Kalispell MT Worm Lund - Seattle WA Raymon F. Thompson - Kalispell MT Larry M. Beasley - Austin TX
Assignee:
Semitherm - Kalispell MT
International Classification:
F27D 312
US Classification:
432241
Abstract:
Semiconductor wafers within a supporting vertical wafer tower are positioned within a vertical process chamber through a lower gate valve fixed to a supporting framework. The gate valve is sealed to a similar gate valve at the upper end of a movable load lock on the framework, within which the wafers are subjected to pre-treatment and post-treatment processes. Two load locks are alternately used in conjunction with the process chamber and a wafer loading station on the framework. In addition, a cleaning element is movably mounted on the framework for periodically maintaining the interior surfaces of the process tube within the process chamber.
James D. Miller - Bellevue WA Worm Lund - Bellevue WA Donald W. Jones - Seattle WA
Assignee:
Robbins Machine, Inc. - Seattle WA
International Classification:
E21B 1020
US Classification:
175344
Abstract:
A raise bit (10) is constructed with a plurality of housings (30) secured to cutter carrier frame (14) and disposed about drive stem (12). Housings (30) include a rectangularly-shaped mounting box (48) for rotatably supporting an outboard roller cutter (28). Each housing (30) also includes an upright wall (34) having an upwardly tapered lug (40) extending along the upper edge portion thereof for seating within a correspondingly shaped groove (82) formed along the underside of shoulder section (78) of an L-shaped hanger bracket (68). A roller shell (72) is antifrictionally mounted on a spindle (70) extending outwardly from an upright section (76) of hanger bracket (68). Bracket (68) is held in hooked relationship over lug (40) by a pair of capscrews (74) extending downwardly through clearance holes formed in upright section (76) and engaging within a lower portion of upright wall (34).
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