Ying Y Zhao

US Patent:

8390103, Mar 5, 2013

Filed:

Aug 5, 2010

Appl. No.:

12/851288

Inventors:

Ying Zhao - Andover MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/495

US Classification:

257666, 257669, 257692, 257E23043, 257E23048

Abstract:

Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

US Patent:

8610254, Dec 17, 2013

Filed:

Mar 1, 2013

Appl. No.:

13/783095

Inventors:

Ying Zhao - Andover MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/495

US Classification:

257666, 257669, 257692, 257E23043, 257E23048

Abstract:

Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

US Patent:

20180369503, Dec 27, 2018

Filed:

Jul 27, 2018

Appl. No.:

16/048067

Inventors:

YING ZHAO - LEXINGTON MA, US

International Classification:

A61M 5/42
A61M 5/142
A61M 5/32

Abstract:

A method for reducing patient stress during prolonged subcutaneous pharmaceutical injection wherein a flexible, nonmetallic sleeve is provided for pharmaceutical delivery. A penetration needle, disposed in the sleeve, allows the flexible sleeve to penetrate a patient's skin. Once the flexible, nonmetallic sleeve has penetrated a patient's skin the penetration needle is removed and a delivery needle is introduced to an upper and of the sleeve.

US Patent:

20160141440, May 19, 2016

Filed:

Nov 18, 2015

Appl. No.:

14/945255

Inventors:

- Hamilton, BM
Ying Zhao - Andover MA, US
Shrenik Deliwala - Andover MA, US

International Classification:

H01L 31/12
H01L 31/18

Abstract:

An optical sensor module is disclosed. The optical sensor module can include a housing comprising an air cavity. An optical emitter die can be disposed in the air cavity of the housing. A top surface of the optical emitter die can face a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing. An optical sensor die can be disposed in the air cavity of the housing adjacent the optical emitter die. The optical sensor die can be spaced from the optical emitter die by a lateral distance. A top surface of the optical sensor die can face the first side of the housing. There may be no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die.

US Patent:

20140340302, Nov 20, 2014

Filed:

May 13, 2014

Appl. No.:

14/276238

Inventors:

- Norwood MA, US
Shrenik Deliwala - Andover MA, US
Ying Zhao - Andover MA, US
Bruce Fried - Peabody MA, US
William Schoppee - Medway MA, US
Woodrow Beckford - Salisbury NH, US

Assignee:

ANALOG DEVICES, INC. - Norwood MA

International Classification:

G06F 3/042
G06F 3/01

US Classification:

345156, 29428

Abstract:

An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.